PCB-Based Moving Contact Structure for High-Frequency Switching
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Solution Overview
Problem
Conventional electromechanical switches with mechanical contact structures are inadequate for high-frequency signal transmission, leading to increased costs and complexity in mass production, and existing MEMS switches face challenges with stable actuation and high isolation requirements.
Innovation Solution
A contact structure utilizing a PCB-based construction with a moving contact, capable of processing high-frequency signals from DC to microwave, featuring a stacked configuration of basic, spacing, and top layers with specific geometry and actuation methods, allowing for low insertion loss and high isolation, and enabling low-cost mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional mechanical contact structure is used in electromechanical switch, then the switch can be manufactured with simple structure, but it cannot transmit high-frequency signals (1 GHz or higher) effectively
Solution Approach 1:
The contact structure is divided into multiple functional layers including PCB base layer, movable contact layer, insulating layer, and contact pads, allowing each layer to be optimized for its specific function while maintaining overall manufacturability through standard PCB processes
Solution Approach 2:
The patent replaces conventional three-dimensional mechanical contact structures with a planar PCB-based contact structure that uses printed circuit traces and contact pads, eliminating complex mechanical assembly while maintaining electrical connectivity and enabling high-frequency signal transmission
2Volume of moving object
If MEMS switch is used to achieve high-frequency signal processing and miniaturization, then the switch volume is minimized and mass production is enabled, but the manufacturing processes become complicated with numerous steps including oxidizing, depositing, transferring, and etching
Solution Approach 1:
The PCB substrate serves multiple functions simultaneously: it provides mechanical support, electrical connectivity through traces, insulation through the substrate material, and structural framework for the movable contact, eliminating the need for separate components and complex assembly processes
Solution Approach 2:
The patent changes the manufacturing approach from semiconductor fabrication processes to standard PCB manufacturing processes, utilizing familiar techniques like copper plating, solder mask application, and drilling, thereby simplifying the manufacturing workflow while achieving similar miniaturization goals
3Reliability
If MEMS switch with thin dielectric layer and air gap is used, then high isolation can be achieved, but the actuation becomes unstable due to charged dielectric medium and static friction effects
Solution Approach 1:
The patent introduces an insulating layer between the movable contact and the PCB substrate that acts as an intermediary, providing controlled electrical isolation while preventing direct contact that would cause static friction, thereby enabling stable actuation through electrostatic or electromagnetic forces
Solution Approach 2:
The patent transitions from the MEMS approach of using vertical air gaps to a PCB-based approach where isolation is achieved through planar insulating layers and trace routing, moving the isolation mechanism to a different dimensional configuration that reduces the impact of charged dielectric effects
4Ease of manufacture
If conventional electromechanical switch with mechanical contact structure is used, then manufacturing cost is kept low, but the switch cannot process DC to microwave frequency range signals
Solution Approach 1:
The patent uses composite construction combining PCB material (fiberglass or plastic substrate), copper traces for electrical connectivity, and insulating materials, creating a multi-material structure that maintains low manufacturing cost through standard materials while enabling broadband frequency response from DC to microwave ranges
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides stable switch characteristics with low insertion loss and high isolation, supports various actuations, and is suitable for high-frequency signal processing, reducing manufacturing costs and complexity compared to conventional MEMS switches.
Implementation Method 1
The actuating device is driven by electrostatic force which generates a driving force for driving the movable contact
Implementation Method 2
allows many kinds of actuations, such as electrostatic force, electro-magnetic force, piezoelectric effect, or heating effect
Implementation Method 3
allows many kinds of actuations, such as electrostatic force, electro-magnetic force, piezoelectric effect, or heating effect
Implementation Method 4
allows many kinds of actuations, such as electrostatic force, electro-magnetic force, piezoelectric effect, or heating effect
Data Source
AI summary
The present disclosure discloses a contact structure for electromechanical switch. The contact structure is using the design including a PCB and a moving contact to allow the actuations and have great switch characteristics whose range is from DC to high frequency.