PCB Multi-Level Cavity Structure for Thicker Component Mounting
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Solution Overview
Problem
The increasing thickness of components on package substrates due to advancements in smartphone performance necessitates a reduction or maintenance of the overall thickness, requiring the formation of deeper cavities in the package substrate.
Innovation Solution
The use of laser processing and metal etching methods to form interconnected cavities with varying wall surface inclinations, allowing for deeper and easier adjustment of cavity depth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are made thicker to improve smartphone performance, then component performance is improved, but overall substrate thickness increases
Solution Approach 1:
The patent transitions from a single deep cavity to a multi-level cavity structure with multiple openings on different surfaces of the substrate. This dimensional change allows components to be mounted at different heights and depths, effectively utilizing three-dimensional space rather than relying solely on increasing substrate thickness or component height.
Solution Approach 2:
The cavity structure is segmented into multiple levels with separate openings on different surfaces. Each opening provides access to specific cavity regions, allowing selective mounting of components with different thickness requirements at different locations, thereby maintaining overall substrate thickness while accommodating varied component heights.
2Adaptability or versatility
If a single deep cavity is formed to accommodate thicker components, then component mounting capability is improved, but manufacturing complexity increases
Solution Approach 1:
The complex cavity structure is segmented into multiple simpler cavity sections, each accessible through separate openings on different surfaces. This segmentation allows the cavity to be formed through multiple independent processing steps rather than requiring a single complex deep cavity formation process, reducing overall manufacturing complexity.
Solution Approach 2:
The patent introduces intermediate cavity sections that connect different openings to the internal cavity space. These intermediate sections act as mediators, enabling access to deep cavity regions through shallower openings on different surfaces, thereby simplifying the manufacturing process while maintaining the ability to accommodate thick components.
3Length of stationary object
If cavity depth is increased to reduce overall thickness, then overall substrate thickness is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The total cavity depth is segmented into multiple smaller depth increments corresponding to different cavity levels. Each level can be formed with standard precision tolerances rather than requiring a single deep cavity to be formed with extremely tight precision requirements, thereby reducing the overall manufacturing precision burden while achieving the desired reduced substrate thickness.
Solution Approach 2:
Instead of forming a single deep cavity requiring precise depth control, the patent distributes the depth requirement across multiple levels and surfaces. This dimensional redistribution allows each individual cavity section to be manufactured with standard precision, while the cumulative effect achieves the desired overall thickness reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of printed circuit boards with adjustable and deeper cavities, facilitating easier component mounting and reducing the overall thickness of the circuit board.
Implementation Method 1
a first cavity penetrating through at least a portion of the first insulating layer from the first surface in the first direction
Implementation Method 2
a second cavity penetrating through at least a portion of the second insulating layer in the first direction and connected to the first cavity
Data Source
AI summary
The present disclosure relates to a printed circuit board including: a first insulating layer; a first wiring layer disposed on the first insulating layer; a second wiring layer disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer; a third wiring layer disposed on the second insulating layer; a first cavity penetrating through at least a portion of the first insulating layer; and a second cavity penetrating through at least a portion of the second insulating layer and connected to the first cavity. The first and second cavities have different wall surface inclinations, and a depth of the first cavity is smaller than a thickness of the first insulating layer and is greater than a thickness of each of the first and second wiring layers.