PCB Multiband Antenna Layout for Compact Dual-Band Communication
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Solution Overview
Problem
Existing electronic devices lack a dual band antenna that can be easily and inexpensively incorporated to support communication over two different frequency bands, such as 868 MHz and 2.4 GHz, for various wireless applications.
Innovation Solution
A printed circuit board (PCB) implemented multiband antenna with a specific configuration of antenna legs and impedance-matching circuits, allowing operation in two different frequency bands, including a first band centered around 868 MHz and a second band centered around 2.4 GHz, with a compact design fitting within a 260 mm² area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a dual band antenna is designed to support two different frequency bands (e.g., 868 MHz and 2.4 GHz), then the communication capability is improved, but the antenna size and complexity increase
Solution Approach 1:
The patent combines multiple antenna elements (first antenna element for 868 MHz, second antenna element for 2.4 GHz, and third antenna element for 902-928 MHz) into a single integrated antenna structure formed by continuous traces on the PCB. This merging approach enables dual-band (or multi-band) communication capability while maintaining a unified, compact design rather than using separate antenna components, thus improving versatility without proportionally increasing complexity.
Solution Approach 2:
The antenna structure is designed to perform multiple functions by supporting operation across different frequency bands (868 MHz, 2.4 GHz, and optionally 902-928 MHz) through a single integrated structure. The PCB trace configuration allows the same antenna to serve multiple communication protocols and frequency requirements, making it universally applicable for diverse wireless communication needs in electronic devices.
2Area of moving object
If the antenna is designed with a compact form factor for small electronic devices, then the device size is reduced, but the antenna performance and bandwidth may deteriorate
Solution Approach 1:
The patent utilizes the third dimension (vertical layering) by implementing the antenna traces on multiple layers of the PCB and using vias to connect them. This vertical stacking allows the antenna to achieve the electrical length required for lower frequency bands (like 868 MHz) within a compact planar footprint, thereby maintaining antenna performance in a small area by transitioning from two-dimensional to three-dimensional trace routing.
Solution Approach 2:
The antenna design nests multiple antenna elements within a compact PCB area by routing traces in overlapping and interleaved patterns across different layers. The first, second, and third antenna elements are nested within the same physical envelope, with traces winding through the PCB structure to achieve the necessary electrical lengths for different frequency bands without increasing the overall antenna footprint.
3Ease of manufacture
If multiple antenna elements are integrated into a single PCB structure, then manufacturing cost is reduced, but the design and fabrication complexity increases
Solution Approach 1:
By merging multiple antenna elements into a single PCB structure using standard PCB fabrication processes (traces and vias on conventional layers), the design eliminates the need for separate antenna components, assemblies, and soldering operations. This consolidation reduces manufacturing steps and material costs despite the increased trace routing complexity, as it leverages the existing PCB manufacturing capability rather than requiring additional assembly processes.
Data Source
AI summary
A printed circuit board implemented antenna includes an antenna leg supported by a printed circuit board having a plurality of different metal layers. The antenna leg has a length extending between a first end and a second end of the antenna leg. The antenna leg includes a plurality of series connected metal segments. Each of at least two of the plurality of series connected metal segments is electrically connected to at least two neighboring metal segment of the plurality of series connected metal segments, and wherein each of the at least two of the plurality of series connected metal segments is formed on a different metal layer of the printed circuit board than each of the at least two neighboring metal segment and is connected to each of the at least two neighboring metal segment through one or more Vias of the printed circuit board.