Reinforced Printed Circuit Board Narrow Area
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Solution Overview
Problem
Thinner printed circuit boards in electronic devices are more prone to damage from external forces due to their narrower width, leading to potential bending or breaking, which impairs device operation.
Innovation Solution
Incorporating a material layer, such as a lead or metal alloy, on the surface of narrower areas of the printed circuit board to enhance its strength and resistance to external forces, thereby preventing damage and ensuring proper device operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the printed circuit board is made thinner to reduce device weight and size, then the device becomes more lightweight and compact, but the printed circuit board becomes more easily damaged by external forces
Solution Approach 1:
The patent applies local quality by adding a material layer specifically to the narrower area of the printed circuit board where strength is most needed. This localized reinforcement prevents bending and breaking at the narrow section without requiring the entire board to be thicker, thus maintaining overall device lightweight design while improving specific vulnerable areas.
2Area of stationary object
If the width of the printed circuit board is reduced to minimize device footprint, then the device becomes more compact, but the printed circuit board becomes more prone to bending and breaking
Solution Approach 1:
The patent implements local quality by placing a material layer specifically on the narrower area of the printed circuit board. This targeted approach provides enhanced stability and resistance to bending at the vulnerable narrow section while maintaining the overall compact footprint of the device.
Solution Approach 2:
The patent uses composite materials by combining the existing printed circuit board material with an additional material layer (such as lead or metal alloy) on the narrower area. This composite structure provides both the compactness of the thin board and the enhanced stability needed to resist external forces.
3Strength
If a material layer is added to reinforce the narrower area of the printed circuit board, then the strength and stiffness of the board improves, but the manufacturing complexity increases
Solution Approach 1:
The patent reduces manufacturing complexity by applying the material layer only to the narrower area of the printed circuit board rather than the entire board. This localized approach simplifies the manufacturing process compared to full-board reinforcement, as the material layer is applied only where structurally necessary.
Data Source
AI summary
An electronic device including reinforced printed circuit board is provided. The electronic device includes the printed circuit board including a first area, and a second area that extends from a first end of the first area. A width of the second area is smaller than a width of the first area, and at least a portion of a surface of the second area is covered by a material layer that provides the second area with a specific strength.