PCB Manufacturing via Nickel Intermediary Layer
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Solution Overview
Problem
The bonding force between the single side copper clad laminate and the electroplating copper layer in double layer printed circuit boards is poor, leading to easy damage and oxidation of electrically conductive circuit traces, which reduces productivity.
Innovation Solution
A method involving a copper foil substrate, an adhesive sheet, and a copper foil sheet where a first opening is defined in the adhesive sheet, allowing for the formation of an electrically conductive hole with a black oxide treatment, and an electroplating copper layer is formed on the inner sidewall of the hole, followed by selective etching to create conductive circuit patterns, and a nickel gold layer is applied for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electroplating copper layer is formed on the exposed substrate surface, then copper plating can be achieved, but the bonding force is poor and the layer damages easily
Solution Approach 1:
A nickel layer is introduced as an intermediary between the copper clad laminate and the electroplating copper layer. This nickel layer serves as a bonding intermediary that enhances adhesion between the substrate and the copper plating, preventing direct contact between the electroplating solution and the substrate while maintaining strong bonding force.
Solution Approach 2:
The nickel layer is formed on the substrate surface before the electroplating process. This preliminary action prepares the surface with proper adhesion properties, ensuring that the subsequent copper plating will bond strongly to the substrate rather than forming a weak bond directly on the copper clad laminate.
2Ease of manufacture
If electroplating copper layer is formed on the exposed substrate surface, then copper plating can be achieved, but the electroplating copper layer damages easily
Solution Approach 1:
The nickel layer acts as a protective intermediary that strengthens the overall structure. It provides a robust base layer that prevents the thin electroplating copper layer from damaging easily, while still allowing the copper plating to be formed on top.
3Ease of manufacture
If the substrate is exposed to electroplating materials, then electroplating can proceed, but the drying process is slow and oxidation occurs
Solution Approach 1:
The nickel layer serves as a barrier intermediary that prevents electroplating materials from directly contacting the substrate. This allows the electroplating process to proceed on the nickel layer while preventing the substrate from absorbing plating solutions, thereby eliminating the slow drying issue and preventing oxidation of circuit traces.
4Ease of manufacture
If the substrate is exposed to electroplating materials, then electroplating can proceed, but circuit traces are easily oxidized
Solution Approach 1:
The nickel layer acts as a protective barrier that prevents harmful electroplating materials from reaching and oxidizing the circuit traces on the substrate. It allows the electroplating process to occur on the nickel surface while isolating the substrate and its sensitive circuit traces from exposure to plating chemicals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the bonding strength and durability of the electroplating copper layer, reducing oxidation and increasing productivity by avoiding direct exposure of the substrate to electroplating materials, resulting in a higher quality printed circuit board.
Implementation Method 1
an electroplating copper layer is formed on the inner sidewall of the hole
Data Source
AI summary
A printed circuit board includes a first electrically conductive circuit pattern, a substrate layer, an adhesive sheet, and a second electrically conductive circuit pattern, which are arranged in the above described order. The printed circuit board includes a single layer electrically conductive circuit area. The adhesive sheet defines a first opening spatially corresponding to the single layer electrically conductive circuit area. The adhesive sheet includes a first inner sidewall surrounding the first opening. The second electrically conductive circuit pattern defines a second opening spatially corresponding to the single layer electrically conductive circuit area. The second electrically conductive circuit pattern includes a second inner sidewall surrounding the second opening. The first inner sidewall and the second inner sidewall are not completely coplanar.