PCB Non-Conductive Areas for Electronic Module Cooling
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Solution Overview
Problem
Existing cooling solutions for telematics control units in vehicles are inefficient due to high thermal conductivity of traditional printed circuit boards, which can lead to reduced availability of communication services due to overheating.
Innovation Solution
The electronic assembly incorporates a printed circuit board with non-electrically conductive areas in the electrically conductive layers, reducing thermal conductivity and enhancing global cooling of the electronic module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional printed circuit boards with continuous electrically conductive layers are used, then electrical connectivity is maintained, but thermal conductivity is high causing overheating of electronic modules
Solution Approach 1:
The patent applies local quality by introducing non-electrically conductive areas specifically in regions where heat dissipation is needed, while maintaining electrically conductive paths in areas requiring electrical connectivity. This selective modification allows the printed circuit board to have different thermal and electrical properties in different zones, enabling localized heat blocking without compromising overall electrical functionality.
Solution Approach 2:
The patent uses composite materials by combining electrically conductive and non-electrically conductive materials within the same printed circuit board structure. The non-electrically conductive areas are formed by removing conductive material or using insulating materials, creating a composite structure that simultaneously provides both electrical connectivity and thermal insulation properties.
2Loss of energy
If non-electrically conductive areas are introduced in electrically conductive layers, then thermal conductivity is reduced improving cooling, but electrical connectivity may be compromised
Solution Approach 1:
The patent applies segmentation by dividing the electrically conductive layers into distinct regions: areas with electrically conductive material for electrical connectivity and areas without (non-electrically conductive areas) for thermal insulation. This segmentation allows independent optimization of thermal and electrical properties in different zones of the printed circuit board.
Solution Approach 2:
The non-electrically conductive areas act as thermal intermediaries that block heat transfer paths while the electrically conductive areas maintain electrical pathways. This intermediary structure enables the printed circuit board to simultaneously manage both thermal and electrical requirements without requiring separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves the cooling efficiency of electronic modules in vehicles, maintaining optimal operating temperatures and ensuring reliable communication services.
Implementation Method 1
the presence of non-electrically conductive areas in the electrically conductive layers thus allows reducing significantly the thermal conductivity of the printed circuit board and thus improving the global cooling of the electronic module
Data Source
AI summary
An electronic assembly is disclosed. The electronic assembly includes a printed circuit board including an alternating arrangement of electrically conducting layers and electrically insulated layers, and at least one electronic module fixed on a first side of the printed circuit board. The electronic module includes multiple pins so as to electrically couple the electronic module and the printed circuit board. The electronic assembly also includes at least one cooling module placed on a second side of the printed circuit board. Each electrically conductive layer of the printed circuit board includes a non-electrically conductive area extending along at least a part of a closed outline positioned around a central axis going through a center of the cooling module and a center of the electronic module.