PCB Clearance Openings for Planar Cooling of Mixed-Height Components

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Solution Overview

Problem

Existing cooling solutions for electronic devices with varying component dimensions are complex, require high production expenditure, and have limited compatibility and usability due to the need for structuring and adaptation to specific component heights.

Innovation Solution

A printed circuit board with openings allowing components to protrude and be cooled from the soldering side, enabling a planar cooling device that adapts to varying component heights without complex structuring, using soldered bonds and optional heat conduction pads for thermal contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a single cooling device is provided to cool multiple components with varying dimensions, then the cooling device must be complexly structured to accommodate different component heights, but this increases production expenditure and reduces compatibility

Engineering Contradiction:

Improvecompatibility with different component heightsVSAvoidstructuring of cooling device

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Instead of accessing components from the assembly side (conventional approach), the cooling device accesses components from the soldering side through openings in the PCB. This inversion allows the cooling device to contact component surfaces that protrude through the PCB, eliminating the need to accommodate varying component heights through complex structuring.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The cooling approach transitions from vertical access (from assembly side) to horizontal access (from soldering side through PCB openings). By changing the dimensional approach, the cooling device can interact with component surfaces in a planar configuration, simplifying its structure while maintaining compatibility with various component heights.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If cooling is performed from the assembly side, then the cooling device must be adapted to the height profile of components, but this increases production expenditure and limits usability

Engineering Contradiction:

Improveproduction expenditureVSAvoidusability with different components

Core Design Contradiction:

Ease of manufactureVSEase of operation

Solution Approach 1:

The cooling device designed for soldering side access serves multiple components with varying heights uniformly. By positioning the cooling device on the soldering side and allowing components to protrude through PCB openings, a single standardized cooling device structure can cool multiple different components without requiring adaptation, thereby improving universality and reducing production costs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If components have different height dimensions, then the cooling device must be adapted for each specific combination, but this restricts compatibility and increases production costs

Engineering Contradiction:

ImprovecompatibilityVSAvoidadaptation requirements

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The PCB is segmented with individual openings for each component, allowing each component to be independently positioned and accessed by the cooling device. This segmentation enables components of varying heights to be accommodated without requiring the cooling device itself to be segmented or adapted, as each component can be cooled through its own opening from the soldering side.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces production costs and improves compatibility by allowing components with different heights to be cooled uniformly, simplifying assembly and maintenance without requiring complex adaptations.

Implementation Method 1

at least one component surface of the component provided for the coupling with a cooling device... configured to transport the occurring amounts of heat away

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260113834A1Electronic Device and System With an Improved Cooling Concept

Publication Date: 2026.04.23 BAYERISCHE MOTOREN WERKE AG

AI summary

An electronic device including at least one printed circuit board and at least one electrical or electronic component. The printed circuit board has an assembly side and an opposite soldering side and includes at least one clearance opening, which corresponds to the at least one component and passes through the printed circuit board in the direction of its thickness. The at least one component adjoins the clearance opening and protrudes into it, and therefore the component is exposed from the soldering side and can be cooled by means of a cooling device facing the soldering side.