PCB Over-Temperature Detection via Opposite-Surface Sensing Circuit
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Solution Overview
Problem
In electronic devices, loose connections between conducting wires and lock attachment elements can lead to high temperatures at connecting points, causing damage or fire hazards due to inadequate temperature detection efficiency.
Innovation Solution
An over temperature detecting method using a sensing circuit on one surface of a printed circuit board to sense temperature at detecting points and output voltage signals, which are then processed by a control circuit on the opposite surface to determine if over temperature conditions exist, utilizing metal conducting layers for efficient heat transfer and improved detection accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the sensing circuit is arranged on the same surface as the detecting points, then the detection structure is simpler, but the heat transfer efficiency is insufficient leading to delayed temperature detection
Solution Approach 1:
The patent applies dimensionality change by moving the sensing circuit from the same surface (2D plane) to the opposite surface of the printed circuit board, utilizing the third dimension (depth/height) to improve heat transfer efficiency. This spatial reconfiguration allows the sensing circuit to be positioned closer to the heat source through the board's thickness, enabling faster and more accurate temperature detection without increasing surface complexity.
2Measurement precision
If the sensing circuit is arranged on the opposite surface to the detecting points, then the heat transfer efficiency is improved, but the circuit layout flexibility is reduced
Solution Approach 1:
The patent applies segmentation by dividing the circuit board into two functional surfaces: the first surface for detecting points (connection terminals) and the second surface for the sensing circuit. This segmentation allows each surface to be optimized independently - the first surface for electrical connections and the second surface for temperature sensing - thereby resolving the conflict between heat transfer efficiency and circuit layout flexibility.
3Reliability
If traditional temperature detection methods are used, then the device structure is simpler, but the detection efficiency is insufficient leading to potential damage or fire hazards
Solution Approach 1:
The patent applies preliminary action by implementing proactive temperature monitoring that detects abnormal temperatures before they cause damage or fire hazards. The sensing circuit continuously monitors temperature at detecting points and provides early warning, allowing preventive measures to be taken before critical failure occurs, thereby enhancing safety without compromising detection efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances temperature detection efficiency and accuracy, allowing for timely detection of abnormal high temperatures and prevention of damage or hazards by arranging the sensing circuit opposite to the detecting points, facilitating better heat transfer and flexible circuit layout.
Implementation Method 1
the sensing circuit is arranged at a second surface opposite to the first surface of the printed circuit board... facilitating better heat transfer
Data Source
AI summary
An electronic device includes a printed circuit board (PCB), a control circuit, and a sensing circuit. The control circuit is configured to determine whether over temperature occurs at one or more detecting points arranged at a first surface of the printed circuit board according to at least one voltage signal. The sensing circuit is arranged at a second surface opposite to the first surface of the printed circuit board and configured to sense the temperature of the one or more detecting points and correspondingly output the voltage signal to the control circuit.