PCB Optical Connector Assembly with Blind-Mate Alignment

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Solution Overview

Problem

The existing methods for optically connecting components on a printed circuit board (PCB) are prone to damage, costly, and time-consuming, especially when using optical fibers and connectors, and the integration of optical infrastructure into PCBs increases manufacturing costs and makes them unsuitable for high-volume, low-cost applications.

Innovation Solution

A PCB assembly that integrates optical and electrical infrastructure, featuring a connector assembly with protected optical fibers and a blind-mate floating optical connector for quick and reliable assembly, along with guiding features for alignment, and a heat-sink for thermal management, allowing for both optical and electrical coupling with the PCB.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If optical fibers and connectors are used for high data rate signal transmission, then signal integrity and data rate are improved, but assembly time and production cost increase

Engineering Contradiction:
Improvesignal integrityVSAvoidassembly time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent applies preliminary action by pre-attaching optical connectors to the optical fibers during PCB manufacturing, so that when components are mounted, the optical connections are already in place. This eliminates the need for separate connector installation steps, reducing assembly time while maintaining signal integrity through proper pre-positioning of connectors.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent merges the optical connection infrastructure with the PCB structure by integrating optical fibers and connectors directly into the board during manufacturing. This combination of electrical and optical infrastructure into a single integrated platform reduces the number of separate assembly steps and components, thereby reducing overall assembly time while preserving high data rate transmission capabilities.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If optical connectors are manually installed and engaged, then optical connection is achieved, but assembly time increases and connection reliability decreases

Engineering Contradiction:
Improveconnection reliabilityVSAvoidassembly time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces manual mechanical connector installation with an automated integration process during PCB manufacturing. Optical fibers and connectors are pre-positioned and fixed to the PCB using automated placement and curing systems, eliminating manual handling. This substitution increases connection reliability through consistent positioning while dramatically reducing assembly time through automation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent applies preliminary action by pre-attaching optical connectors to the optical fibers during PCB manufacturing, so that when components are mounted, the optical connections are already in place. This eliminates the need for separate connector installation steps, reducing assembly time while maintaining signal integrity through proper pre-positioning of connectors.

Inventive Principle:
Principle #10Preliminary action

3Ease of operation

If optical fibers are exposed during assembly, then connection flexibility is maintained, but optical infrastructure is prone to damage

Engineering Contradiction:
Improveconnection flexibilityVSAvoiddamage risk
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by pre-protecting optical fibers with protective coatings and pre-positioning them in protected channels within the PCB structure during manufacturing. This preliminary protection measures ensure that fibers remain protected throughout the assembly process while maintaining their optical transmission properties and connection capabilities.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements beforehand cushioning by incorporating protective buffer layers and flexible protective sheathing around optical fibers before they are subjected to assembly stresses. These pre-applied protective elements absorb mechanical stresses and prevent damage to the fragile optical infrastructure while allowing the necessary flexibility for connection.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

4Object-affected harmful factors

If pivotable connector mechanism is used to protect optical fibers, then optical infrastructure is protected, but device complexity and production cost increase

Engineering Contradiction:
Improveprotection from damageVSAvoidconnector mechanism complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent extracts the protective function from complex mechanical pivotable connector mechanisms and implements it through simpler integrated PCB structures. Optical fibers are embedded in protective channels and coated with protective materials directly during PCB manufacturing, eliminating the need for separate mechanical protection systems while maintaining adequate protection from damage.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces expensive, complex pivotable connector mechanisms with simpler, cost-effective protective structures integrated into the PCB. The protective function is achieved through material coatings and structural design rather than complex mechanical systems, reducing device complexity and production cost while providing sufficient protection for the optical infrastructure.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides a convenient, quick, and reliable assembly method that protects optical infrastructure from damage, reduces production costs, and enables efficient high-data-rate signal transmission while maintaining the integrity of the optical components.

Implementation Method 1

a heat-sink for thermal management

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10473871B2Printed circuit board assembly
Publication Date: 2019.11.12 HEWLETT PACKARD ENTERPRISE DEV LP
  • US10473871B2 patent drawing
  • US10473871B2 patent drawing
  • US10473871B2 patent drawing

AI summary

An optoelectronic assembly for a printed circuit board (PCB) assembly is described herein. The optoelectronic assembly may include a component carrier for mounting an active component, and a connector assembly for achieving a coupling between the component carrier and PCB-side optical infrastructure on a printed circuit board (PCB). The connector assembly can include a plurality of optical fibers connected to the component carrier, a first optical connector connected to the optical fibers for coupling with the PCB-side optical infrastructure on the PCB, and a housing member for housing the optical fibers and the first optical connector.