PCB Pad Retention via Connection Layer Groove Anchoring

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Solution Overview

Problem

As electronic devices become smaller, the metal posts on printed circuit boards (PCBs) are also miniaturizing, leading to a risk of these posts becoming separated from the PCB and being lost.

Innovation Solution

A printed circuit board design that includes a first insulating layer, a pad portion, a connection layer with a central portion and an extension portion, and a second insulating layer. The extension portion of the connection layer is located within a groove portion of the second insulating layer, enhancing the adhesion and reducing the risk of the connection layer being lost.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the metal posts are miniaturized to reduce device size, then the device size is reduced, but the metal posts become separated from the printed circuit board and lost

Engineering Contradiction:
Improvedevice sizeVSAvoidmetal post retention
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The connection layer extends in the horizontal direction along the pad portion, creating a dimensional extension that anchors the metal post to the pad. This horizontal extension prevents vertical separation, solving the retention problem while maintaining miniaturization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The connection layer is divided into a central portion (vertical connection) and an extension portion (horizontal anchoring). This segmentation allows the structure to fulfill multiple functions: electrical connection and mechanical retention, preventing post loss during miniaturization.

Inventive Principle:
Principle #1Segmentation

2Reliability

If the connection layer is extended to prevent post separation, then the adhesion is enhanced, but the device complexity increases

Engineering Contradiction:
Improvepad portion adhesionVSAvoidconnection layer structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The connection layer merges the central portion and extension portion into a single continuous metal structure formed by one deposition process. This integration enhances adhesion without requiring additional manufacturing steps, avoiding increased device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The connection layer serves dual functions: the central portion provides vertical electrical connection while the extension portion provides horizontal mechanical anchoring. This multi-functionality achieves enhanced adhesion without adding separate components, maintaining manufacturing simplicity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250176103A1Printed circuit board and manufacturing method thereof
Publication Date: 2025.05.29 SAMSUNG ELECTRO MECHANICS CO LTD
  • US20250176103A1 patent drawing
  • US20250176103A1 patent drawing
  • US20250176103A1 patent drawing

AI summary

A printed circuit board includes a first insulating layer; a pad portion located on the first insulating layer; a connection layer located on the pad portion and including a central portion and an extension portion extending from the central portion toward an edge of the pad portion; and a second insulating layer located on a portion of the pad portion and a portion of the connection layer, in which the extension portion of the connection layer may be located within a groove portion formed in the second insulating layer, and an upper surface of the extension portion of the connection layer may be covered with the second insulating layer.