PCB Pad Layout for Multi-Supplier RF Front-End Module Compatibility

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Solution Overview

Problem

The design of printed circuit boards (PCBs) in electronic devices is often tailored to specific electronic components, leading to increased costs and difficulties in accommodating components from different suppliers with varying designs, even if they have the same function, and making it challenging to change or differentiate components without redesigning the PCB.

Innovation Solution

A PCB design that includes designated areas with multiple pads and connection members, allowing for the mounting of electronic components with different designs without altering the PCB, enabling compatibility with various suppliers' components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the PCB design is tailored to specific electronic components, then the components can be properly mounted and connected, but the cost increases and it becomes difficult to accommodate components from different suppliers with varying designs

Engineering Contradiction:
Improvecompatibility with different component designsVSAvoidPCB design complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements a universal PCB pad layout design that can accommodate multiple different electronic component designs. The PCB includes designated areas with multiple pads arranged to support various component configurations, allowing the same PCB to work with components from different suppliers without requiring redesign. This multi-functional pad arrangement enables the PCB to serve multiple component types universally.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Manufacturing precision

If the PCB design is customized for each component supplier's design, then precise connection is achieved, but development costs and production time increase

Engineering Contradiction:
Improveconnection precisionVSAvoiddevelopment efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent employs preliminary action by pre-arranging multiple pads in designated areas on the PCB before component mounting. The pad locations are predetermined to accommodate various component designs, allowing components to be directly mounted and connected without requiring subsequent PCB modifications. This preliminary pad configuration ensures both precise connection and efficient production.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If the PCB design is changed to verify electronic components from various suppliers, then component compatibility is ensured, but design and production costs are wasted

Engineering Contradiction:
Improvecomponent verification accuracyVSAvoiddesign and production costs
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The patent creates a universal PCB design with multi-purpose pad arrangements that can verify and accommodate components from various suppliers without requiring separate PCB designs. The same PCB can be used to test and mount different component variants, eliminating the need to manufacture multiple specialized PCBs and thereby reducing design and production costs while maintaining verification accuracy.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Productivity

If a single PCB design is used for all component suppliers, then manufacturing efficiency is improved, but compatibility with various component designs may be compromised

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidcomponent compatibility
Core Design Contradiction:
ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality by creating designated areas on the PCB with specific pad arrangements tailored for different component types. Each designated area has pads positioned to accommodate particular component designs, while the overall PCB maintains a unified structure. This localized adaptation within a global standard enables both manufacturing efficiency and component compatibility.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12581598B2Electronic device comprising printed circuit board
Publication Date: 2026.03.17 SAMSUNG ELECTRONICS CO LTD
  • US12581598B2 patent drawing
  • US12581598B2 patent drawing
  • US12581598B2 patent drawing

AI summary

An example electronic device may include a first printed circuit board including a specified area. The first printed circuit board may include at least one first pad and at least one second pad formed in the specified area, wherein, when a first radio frequency (RF) front end module is disposed in the specified area of the first printed circuit board, at least one first pad is in contact with the first RF front end module and at least one second pad is not in contact with the first RF front end module, and, when a second RF front end module is disposed in the specified area of the first printed circuit area, at least one first pad and at least one second pad are in contact with the second RF front end module.