PCB Panel Cavity Reinforcement for Heat Deformation
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Solution Overview
Problem
The challenge is to prevent deformation of printed circuit boards (PCBs) with cavities during the heating process for soldering and subsequent cutting, which affects their size reduction and electrical connections.
Innovation Solution
A manufacturing method involving a PCB panel with extended lines on cavity stays that support the cavity area, minimizing heat influence and allowing for precise cutting, thereby preventing deformation and enabling further size reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a cavity is formed in the PCB to reduce component protrusion height, then the PCB thickness is reduced, but the PCB becomes vulnerable to heat-induced deformation during soldering
Solution Approach 1:
The patent applies local quality by extending stays specifically in the cavity area to provide localized reinforcement. The stays are positioned to extend from the cavity toward the PCB edges, creating a localized support structure that prevents heat-induced deformation in the critical cavity region without affecting the overall thin PCB design.
Solution Approach 2:
The patent implements preliminary action by pre-forming the cavity and positioning the stays before the soldering process. The stays are extended and secured in advance to create a reinforcement structure that will prevent deformation during the subsequent heating process, ensuring the PCB maintains its dimensional stability throughout the manufacturing cycle.
2Ease of manufacture
If stays are cut off to free the PCB from the panel, then the PCB can be removed, but the PCB may become deformed and break electrical connections
Solution Approach 1:
The patent applies local quality by extending stays specifically in the cavity area to provide localized reinforcement. The stays are positioned to extend from the cavity toward the PCB edges, creating a localized support structure that prevents heat-induced deformation in the critical cavity region without affecting the overall thin PCB design.
Solution Approach 2:
The patent implements preliminary action by pre-forming the cavity and positioning the stays before the soldering process. The stays are extended and secured in advance to create a reinforcement structure that will prevent deformation during the subsequent heating process, ensuring the PCB maintains its dimensional stability throughout the manufacturing cycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively strengthens the cavity area against heat-induced deformation and facilitates efficient cutting, ensuring the PCBs remain undistorted and can be made smaller in size.
Implementation Method 1
heating the PCB panel to reflow solder the electronic component to the PCB
Data Source
AI summary
A manufacturing method, Printed Circuit Board (PCB) panel, and a PCB are disclosed. The method includes forming a cavity in a PCB that is in a PCB panel that includes a frame and stays, mounting an electronic component, heating the PCB panel, and cutting the stays. The PCB panel includes a frame body and a PCB coupled to the frame body via stays. The PCB includes a cavity. A first cavity stay is located near the cavity. Extended lines extend from the cavity, and the cavity stay extends at least between the extended lines. The PCB includes a cavity and a connection point from a cavity stay near the cavity.