PCB Parasitic Element Isolator for MIMO Antenna Systems
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Solution Overview
Problem
Conventional isolators in MIMO antenna systems face challenges with increased coupling interference due to reduced spacing between radiating elements, leading to degraded isolation performance and poor common-grounding, which affects beam forming and passive intermodulation (PIM) performance, and occupy a large area on the feed board.
Innovation Solution
The design of an isolator comprising a parasitic element and a support element as separate printed circuit board components, with a printed electrically-conducting segment and connecting portions that engage the base board, allowing for optimized function and reliable connection, reducing interference by avoiding common grounding and minimizing space on the feed board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional isolators are made of sheet metal and mounted using rivets or bolts, then reliable connection is achieved, but common-grounding is degraded and PIM performance is affected
Solution Approach 1:
The isolator is divided into two separate components: a parasitic element and a support element. The parasitic element serves as the isolator body while the support element provides mounting functionality. This segmentation allows the parasitic element to be designed without grounding connections, eliminating the common-grounding issue while maintaining structural reliability through the dedicated support element.
2Reliability
If conventional isolators occupy large area on feed board, then reliable connection is achieved, but cost increases and routing difficulty increases
Solution Approach 1:
By separating the parasitic element from the support element, the isolator footprint on the feed board is minimized. Only the compact support element with its connecting portions occupies space on the feed board, while the parasitic element extends forwardly to provide isolation functionality. This significantly reduces the area occupied compared to conventional unitary isolators.
3Productivity
If spacing between radiating elements is decreased, then antenna array density is improved, but coupling interference increases and isolation performance degrades
Solution Approach 1:
The parasitic element acts as an intermediary structure positioned between adjacent radiating element arrays. It provides electromagnetic isolation by creating a protective barrier that reduces coupling interference between the densely packed arrays, enabling high array density without sacrificing isolation performance.
4Adaptability or versatility
If parasitic element and support element are designed separately, then adaptability to different application scenarios is improved, but device complexity increases
Solution Approach 1:
The isolator is divided into two separate printed circuit board components that can be independently designed and optimized. The parasitic element can be configured with different geometries for various isolation requirements, while the support element can be adapted to different mounting configurations. This modular approach increases adaptability while keeping each individual component relatively simple.
Data Source
AI summary
An isolator for an antenna system includes a printed circuit board based parasitic element, where the parasitic element has a functional portion and a first connecting portion, and the functional portion has a printed electrically-conducting segment, and the first connecting portion is configured to engage a base board of the antenna system. The isolator further includes at least one support element configured as a second printed circuit board component, where the support element has a second connecting portion, and the second connecting portion is configured to engage the base board of the antenna system, and the support element is configured to support the parasitic element.