PCB Patch Antenna Ground Layout for Compact Dual-Polarized Feeds
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Solution Overview
Problem
The challenge of maintaining antenna performance while reducing the size of the antenna structure is exacerbated by the increase in electronic device functions and thickness reduction, leading to insufficient space and deterioration of feed-to-feed coupling.
Innovation Solution
The implementation of a printed circuit board (PCB) with multiple layers and strategically positioned ground paths that electrically couple patch antennas, including via penetrations and ground paths to maintain or improve antenna performance despite reduced ground size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the ground width is decreased to reduce antenna structure size, then the antenna structure size is reduced, but the feed-to-feed coupling feature deteriorates and antenna performance deteriorates
Solution Approach 1:
The patent transitions from a two-dimensional ground plane to a three-dimensional ground structure by adding a ground protrusion that extends vertically from the ground plane. This vertical dimension provides additional ground area and improves feed-to-feed coupling without increasing the horizontal footprint of the antenna structure, thereby resolving the contradiction between compact size and antenna performance.
Solution Approach 2:
The ground structure is segmented into a ground plane and a ground protrusion as separate functional elements. The ground protrusion is positioned adjacent to the patch antenna and serves as an additional grounding element that enhances coupling between feeds while keeping the overall structure compact. This segmentation allows independent optimization of each component.
2Volume of moving object
If the ground width is decreased to reduce antenna structure size, then the antenna structure size is reduced, but the feed-to-feed coupling feature deteriorates
Solution Approach 1:
By extending the ground structure vertically through the ground protrusion, the patent creates additional coupling paths between feeds in the vertical dimension. This compensates for the reduced horizontal ground width and maintains effective feed-to-feed coupling while achieving a more compact overall antenna structure.
3Adaptability or versatility
If the number of functions is increased and thickness is reduced, then device functionality is improved and portability is enhanced, but space for mounting antenna structure becomes insufficient
Solution Approach 1:
The patent utilizes the vertical dimension through the ground protrusion to provide additional antenna functionality within a compact horizontal footprint. This allows the antenna structure to maintain adequate performance characteristics while occupying less planar space, accommodating increased device functionality and thinner profiles.
Solution Approach 2:
The ground protrusion is nested within or adjacent to the patch antenna structure, creating a compact integrated assembly. This nested configuration maximizes the use of available space by placing multiple functional elements (patch antenna, ground plane, ground protrusion) in close proximity without requiring excessive mounting area.
Data Source
AI summary
An electronic device is provided. The electronic device includes a printed circuit board (PCB) including a plurality of layers, a communication circuit electrically coupled to the PCB, and at least one processor electrically coupled to the communication circuit. The PCB may include a first layer in which a plurality of patch antennas disposed, a first feeding path which feeds a first point of a first patch antenna so that the first patch antenna disposed to the first layer transmits and/or receives a first polarized signal, a second feeding path which feeds a second point of the first patch antenna so that the first patch antenna disposed to the first layer transmits and/or receives a second polarized signal orthogonal to the first polarized signal, a second layer including a ground, a first ground path, and a second ground.