Standard PCB Patch Array for 5G AESA Antennas
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Solution Overview
Problem
The fabrication of beam-forming elements for active electronically steered antenna systems (AESA) using standard printed circuit board processes is complex and affects yield and system performance, particularly in achieving efficient operation within the 5G spectrum.
Innovation Solution
A patch array is formed using a routing printed circuit board with multiple layers and printed circuit board patches, each with at least one through-via, configured to operate within the 5G spectrum, employing standard printed circuit board processes and design rules, and surface-mounted using ball grid arrays, avoiding micro-vias and high-density interconnect technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If standard printed circuit board processes are used to fabricate beam-forming elements, then manufacturing cost and complexity are reduced, but fabrication yield and system performance are adversely affected
Solution Approach 1:
The invention divides the beam-forming element fabrication into modular components: standard PCB patches with through-vias are fabricated using conventional processes, then assembled onto the substrate. This segmentation allows standard processes to be used while maintaining performance through careful design of the modular components and their interconnections.
Solution Approach 2:
The invention modifies design parameters of standard PCB processes to suit millimeter-wave requirements. Specific via dimensions, trace widths, and patch geometries are optimized for 5G spectrum operation. By adjusting these parameters within standard process capabilities, the invention achieves high performance without requiring advanced fabrication technologies.
2Device complexity
If standard printed circuit board processes are used to fabricate beam-forming elements, then manufacturing complexity is reduced, but system performance is adversely affected
Solution Approach 1:
The beam-forming elements are segmented into standard PCB patches that can be manufactured independently using conventional processes. This reduces manufacturing complexity while maintaining system performance through modular assembly and standardized interfaces.
Solution Approach 2:
The invention uses replicated standard PCB patch designs that can be mass-produced using conventional fabrication. By copying proven PCB design patterns and optimizing them for millimeter-wave operation, the invention achieves high performance with simple, scalable manufacturing.
3Ease of operation
If through-vias are used in printed circuit board patches, then signal routing is simplified, but fabrication complexity increases
Solution Approach 1:
The invention uses through-vias extending completely through the PCB patches, which simplifies signal routing by providing direct vertical connections. While this increases via fabrication requirements, the use of standard via processes and optimized via patterns keeps the overall fabrication complexity manageable.
Data Source
AI summary
A patch array has a routing printed circuit board with a plurality of layers for routing signals, and a plurality of printed circuit board patches that each has at least one through-via. The plurality of patches are mounted with the routing printed circuit board. In addition, the plurality of printed circuit board patches are formed in compliance with standard printed circuit board rules.