PCB Patch Antenna Radiator Structure for Stable Impedance Matching
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Solution Overview
Problem
Conventional high frequency radiators for antennas operating in higher frequency ranges, such as 5G bands, are sensitive to manufacturing variations, leading to impedance mismatches due to slight defects or imprecisions in solder joints or mounting of radiator plates.
Innovation Solution
A high frequency radiator design featuring a PCB radiator plate mounted to interlocking PCB stems, with feeder metallic traces and opposing metallic traces connected by vias, reducing the number of solder joints and making the design less sensitive to manufacturing variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional metallic pins with solder joints are used to mount radiator plates, then electrical coupling is achieved, but manufacturing precision deteriorates due to sensitivity to solder joint variations
Solution Approach 1:
The patent merges the radiator plate and support pedestal into a single integrated PCB structure. The PCB radiator plate is mechanically and electrically coupled to the PCB support pedestal, eliminating the need for separate metallic pins and solder joints. This integration ensures that the distance between radiator plates is determined by the rigid PCB structure rather than variable solder joint heights, thereby improving impedance matching while reducing sensitivity to manufacturing variations.
2Reliability
If multiple metallic pins and solder joints are used for mounting, then electrical coupling is achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into the PCB structure. The PCB radiator plate serves as both the radiating element and the mounting structure, while the PCB support pedestal provides both mechanical support and electrical coupling. This eliminates the need for separate metallic pins, support structures, and multiple solder joints, thereby reducing device complexity while maintaining reliable electrical coupling.
Solution Approach 2:
The PCB structure performs multiple functions simultaneously: it acts as the radiating element, the mounting structure, the support pedestal, and the electrical coupling mechanism. This multi-functionality reduces the number of separate components needed, simplifying the overall device while maintaining reliable electrical coupling across all connections.
3Ease of manufacture
If non-conductive support pedestal with metallic pins is used, then mechanical mounting is achieved, but manufacturing precision deteriorates due to bent plates and solder variations
Solution Approach 1:
The patent merges the support pedestal function into the PCB structure itself. The PCB support pedestal is rigidly integrated with the PCB radiator plate, eliminating the need for separate non-conductive pedestals and metallic pins. This integration ensures that the distance between radiator plates is determined by the precise PCB manufacturing process rather than assembly variations, thereby improving manufacturing precision while maintaining ease of manufacture through standardized PCB fabrication.
4Ease of operation
If conventional radiator design with multiple components is used, then assembly is achieved, but productivity decreases due to multiple solder joints required
Solution Approach 1:
The patent integrates the radiator plate and support pedestal into a single PCB assembly, eliminating the need for separate metallic pins and multiple solder joints. This reduction in component count and soldering operations significantly improves productivity and assembly speed while maintaining ease of operation through standardized PCB mounting procedures.
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
Disclosed is a high frequency radiator for an antenna. The high frequency radiator is formed of two interlocking PCB stems on which a radiator plate is mounted. Disposed on each of the interlocking PCB stems are two combinations of a feeder metallic trace and an opposing metallic trace, disposed on opposite sides of the PCB stem and electrically coupled together by at least one via formed in the PCB stem and a solder point within the via. This configuration of high frequency radiator is considerably cheaper to manufacture compared to conventional designs and is less susceptible to impedance matching problems resulting from inconsistent solder joint dimensions.