PCB Pattern Contour Inspection for Fine Defect Evaluation
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Solution Overview
Problem
The existing methods for inspecting resist patterns or conductor patterns on semiconductor package substrates or printed circuit boards are inadequate, particularly for finer patterns, due to difficulties in evaluating the patterns accurately and detecting defects early in the manufacturing process.
Innovation Solution
A pattern inspection method that involves measuring the coordinates of the contour of the pattern using techniques such as reflected light, fluorescent light, or electron beams, and then inspecting the pattern based on these measured coordinates to evaluate its formation state and detect defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional inspection methods (microscope or visual inspection) are used for resist patterns or conductor patterns on semiconductor package substrates or printed circuit boards, then the inspection process is simple, but the measurement precision and ability to detect defects in finer patterns is insufficient
Solution Approach 1:
The patent replaces conventional optical microscope inspection with a coordinate measuring machine (CMM) system that uses tactile or non-contact probing to measure pattern coordinates. This substitution enables precise measurement of finer patterns by transitioning from optical visualization to coordinate-based quantitative measurement, directly resolving the measurement precision limitation while maintaining manageable system complexity through standardized CMM technology.
Solution Approach 2:
The patent introduces a coordinate measurement system as an intermediary between the pattern and the inspection process. By measuring the coordinates of pattern contours and calculating roughness indices through computational analysis, the system enables precise evaluation of pattern quality without requiring direct optical visualization, thus improving measurement precision while using established measurement technology.
2Manufacturing precision
If the pitch of resist patterns or conductor patterns is reduced to achieve finer patterns, then the manufacturing capability is improved, but the roughness of patterns increases causing degradation of electrical characteristics
Solution Approach 1:
The patent performs preliminary measurement and evaluation of pattern roughness using coordinate data before the patterns are mounted and electrical characteristics are tested. By calculating roughness indices from coordinate measurements of resist patterns and conductor patterns, the system enables early detection of patterns that may cause electrical characteristic degradation, allowing for corrective actions to be taken before final product assembly.
Solution Approach 2:
The patent establishes a feedback mechanism where pattern coordinates are measured, roughness indices are calculated, and this information is used to evaluate and control pattern quality. The measured roughness data provides feedback on the manufacturing process, enabling adjustment of patterning parameters to maintain acceptable roughness levels even as pattern pitch is reduced, thus preserving electrical characteristics.
3Loss of information
If conventional qualitative inspection methods are used for patterns on semiconductor package substrates, then the inspection process is simple and fast, but the ability to evaluate and detect defects in finer patterns is insufficient
Solution Approach 1:
The patent replaces qualitative visual inspection with quantitative coordinate measurement and automated roughness calculation. By using a coordinate measuring machine to obtain precise coordinate data and automatically calculating roughness indices, the system recovers lost evaluation information about pattern quality while the automated processing maintains efficient inspection throughput, eliminating the need for time-consuming manual visual assessment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables accurate evaluation of finer resist and conductor patterns on semiconductor package substrates and printed circuit boards, allowing for early detection of defects and improved manufacturing yield.
Implementation Method 1
measuring the coordinates of a contour of the pattern based on reflected light from the target substrate
Implementation Method 2
measuring the coordinates of a contour of the pattern based on fluorescent light from the target substrate
Implementation Method 3
measuring the coordinates of a contour of the pattern based on an electron beam from the target substrate
Data Source
AI summary
A pattern inspection method includes: a coordinate measuring step for measuring the coordinates of a contour of a pattern on a target substrate, which is either a printed circuit board or a semiconductor package substrate for mounting of semiconductor elements on which the pattern is formed; and an inspection step for inspecting the pattern based on the coordinates. A target substrate selection method includes: a coordinate measuring step for measuring the coordinates of a contour of a pattern on a target substrate, which is either a printed circuit board or a semiconductor package substrate for mounting of semiconductor elements on which the pattern is formed; an inspection step for inspecting the pattern based on the measured coordinates; and an evaluation step for evaluating the pattern based on an inspection result in the inspection step.