PCB PCM Coating for Battery Pack Heat and Waterproofing
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Solution Overview
Problem
Conventional printed circuit boards in battery packs face issues with heat dissipation and waterproofing, as silicon coatings used for waterproofing do not effectively discharge heat from heating parts, and water ingress can cause short circuits.
Innovation Solution
A coating layer comprising phase change materials (PCMs) is applied to cover heating parts on the printed circuit board, which includes a thickness of 1 cm to 1.5 cm and is formed to avoid covering metal tabs, using a guide bar to prevent overflow, and is mixed with silicon to reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon is coated on the entire substrate for waterproofing, then waterproofing is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent applies different coating materials to different regions of the substrate. Phase change material is coated only on heating parts where heat dissipation is needed, while other areas receive standard waterproof coating. This localized approach allows heat dissipation in critical areas without compromising overall waterproofing.
Solution Approach 2:
The patent uses a composite coating system combining phase change material with waterproofing properties. This composite material simultaneously provides both thermal management and waterproofing functions, resolving the contradiction between heat dissipation and waterproofing by integrating both functions into a single coating layer.
2Temperature
If phase change material coating is applied to heating parts, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent identifies and marks heating parts before the coating process, allowing for pre-planned application of phase change material. This preliminary identification simplifies the manufacturing process by eliminating the need for complex real-time detection or multi-step application procedures.
Solution Approach 2:
The patent controls the thickness of the phase change material coating within a specific range (1-1.5 cm) to optimize both heat dissipation performance and manufacturing simplicity. By standardizing the coating thickness parameter, the manufacturing process becomes more controllable and less complex.
3Reliability
If coating solution is applied to cover heating parts, then waterproofing and heat dissipation are improved, but overflow onto metal tabs causes defects
Solution Approach 1:
The patent divides the substrate into distinct regions: heating parts that require phase change material coating and metal tab areas that must remain uncovered. This segmentation is achieved through controlled coating application that stops before reaching metal tabs, preventing overflow and coating defects while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The PCM coating layer provides effective waterproofing and heat dissipation, minimizing board size and reducing costs by using a mixed coating solution, while preventing overflow onto metal tabs.
Implementation Method 1
a coating layer including phase change materials (PCMs) is formed
Implementation Method 2
The PCM coating layer provides effective waterproofing and heat dissipation
Data Source
AI summary
Disclosed are a printed circuit board, a battery pack, and a method of manufacturing a printed circuit board. The printed circuit board may include a substrate, a large current stage part disposed in a mounting area of the substrate, and a coating layer including phase change materials (PCMs) and covering the large current stage part.