PCB Pen Core Module Simplifies Assembly and Reduces Failure Rates
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Solution Overview
Problem
Existing capacitance pens have complex core structures, leading to low production efficiency, high manufacturing costs, and high failure rates due to the need for multiple components and complex assembly processes, making them unsuitable for mass production.
Innovation Solution
A simplified pen core module using a printed circuit board (PCB) with annular components and flexible printed circuit (FPC) boards, which simplifies the structure and assembly process through inner hole welding, reducing material and manpower consumption while ensuring a clean and intact appearance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components are used to form the pen core structure, then the functional requirements can be met, but the device complexity increases and manufacturing difficulty rises
Solution Approach 1:
The patent combines multiple functional components (receiving head, pen core cylinder, holder, spring, and circuit board) into a single integrated PCB assembly. The PCB serves as both the structural support and the circuit carrier, eliminating the need for separate mechanical components and reducing assembly complexity while maintaining all required functions.
Solution Approach 2:
The PCB is designed to perform multiple functions simultaneously: it provides structural support, carries electrical circuits, serves as the receiving head for capacitive sensing, and houses the spring mechanism. This multi-functional design reduces the total number of components needed in the pen core.
2Adaptability or versatility
If multiple components and complex assembly processes are used, then the pen core functions can be achieved, but the productivity decreases and manufacturing cost increases
Solution Approach 1:
By integrating all pen core functions into a single PCB assembly, the manufacturing process is simplified from assembling multiple separate components to producing and installing one integrated unit. This dramatically increases production efficiency and reduces manufacturing costs.
Solution Approach 2:
The PCB is pre-assembled with all necessary components (receiving head, spring, circuit elements) before final installation into the pen. This preliminary integration allows for standardized mass production of the core module, improving overall manufacturing productivity.
3Device complexity
If multiple components are bonded and coordinated, then the pen core structure can be formed, but the reliability decreases due to potential defects
Solution Approach 1:
The integrated PCB design eliminates multiple bonding interfaces between separate components. With fewer joints and connections, there are fewer potential failure points, thereby improving the overall reliability of the pen core structure.
4Ease of manufacture
If complex assembly procedures are used, then the pen core can be manufactured, but the loss of time increases and manufacturing cost rises
Solution Approach 1:
The single-integration PCB design reduces the assembly process from multiple discrete steps to a single manufacturing process. This dramatically reduces processing time and makes the manufacturing procedure much easier to standardize and automate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces production costs and failure rates, enhances the stability and crash resistance of the pen core, and maintains a smooth, clean appearance by using a PCB with three circuit layers and FPC boards as pins for improved electrical connections.
Implementation Method 1
heating the pen core module by virtue of the heating component thereof, which melts the solder paste and consequently achieves an electric connection between the interior surfaces of the annular components with the bonding pads of the printed circuit board PCB
Implementation Method 2
heating the pen core module by virtue of the heating component thereof, which melts the solder paste
Implementation Method 3
the molten solder paste changes into solid tin when cooling down, fixing the hollow annular components to the printed circuit board PCB
Data Source
Figure 1
Figure 2~3
AI summary
This invention discloses a simplified pen core module and the preparation method thereof. The pen core module is characterized in that it adopts PCB board as the main body of pen core, and the PCB board is covered with FPC boards that serve as pins; a hollow threaded seat is sleeved at the strip part of the PCB board, and is electrically connected with and fixed at the root step of the strip part; a hollow metal cylinder and a hollow cone part are sleeved in sequence at the relative position of the strip part of the PCB board and, through the hollow interior thereof, electrically connected with the bonding pad of the PCB board and fixed at the relative position; a heat resisting insulation ring is sleeved between every two of the threaded seat, metal cylinder and cone part.