Heat Cost Allocator PCB Perpendicular Sensor Arrangement
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Solution Overview
Problem
Existing heat cost allocators face increased production costs due to the need for a thermally insulating element to shield the room air temperature sensor from radiator heat, which complicates the positioning and function of temperature sensors.
Innovation Solution
The printed circuit board is arranged perpendicularly to the carrier plate, allowing the radiator temperature sensor to be positioned on one end face facing the carrier plate and the room air temperature sensor on an end face away from it, eliminating the need for a thermally insulating element by using metalized, thermally conductive coupling surfaces for accurate measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If both temperature sensors are arranged on the surface of the printed circuit board facing the radiator, then the room air temperature sensor is directly exposed to the heat radiated by the radiator, but a thermally insulating element is required to shield the sensor which increases production costs
Solution Approach 1:
The patent repositions the room air temperature sensor from the front surface of the printed circuit board to the rear surface, utilizing the third dimension (depth/thickness) of the board. This spatial reconfiguration allows the sensor to be thermally isolated from the radiator while maintaining electrical connectivity through the board's internal structure, eliminating the need for additional insulating materials.
Solution Approach 2:
The printed circuit board itself serves as a thermal intermediary, with its internal structure (including ground planes and routing layers) providing thermal isolation between the radiator-mounted rear wall and the room air temperature sensor on the opposite side. The board's design includes thermal management features that mediate heat transfer, allowing the sensor to measure room air temperature without direct thermal coupling to the radiator.
2Ease of operation
If the printed circuit board is arranged obliqu to the carrier plate, then both sensors can be positioned on the same surface, but the room air temperature sensor cannot be properly shielded from radiator heat
Solution Approach 1:
The patent transitions from a two-dimensional arrangement where both sensors sit on the same surface to a three-dimensional arrangement utilizing the board's thickness. The room air temperature sensor is positioned on the rear surface of the PCB, while the radiator temperature sensor remains on the front surface near the carrier plate. This vertical separation in the third dimension provides inherent thermal shielding while maintaining proper sensor positioning for accurate measurements.
Solution Approach 2:
The patent employs asymmetric positioning of the two temperature sensors on opposite surfaces of the printed circuit board, rather than symmetric placement on the same surface. This asymmetric arrangement creates a thermal gradient through the board, with the front surface exposed to radiator heat and the rear surface isolated, allowing each sensor to measure its respective temperature accurately without cross-interference.
3Measurement precision
If a thermally insulating element is added to shield the room air temperature sensor, then accurate measurement is possible, but device complexity and production cost increase
Solution Approach 1:
The printed circuit board is designed to serve multiple functions: it provides electrical connectivity for both temperature sensors, structural support for the housing and carrier plate, and thermal management through its internal layer structure. The ground planes and routing layers of the PCB inherently provide thermal isolation, eliminating the need for separate insulating components. This multi-functional design reduces overall device complexity while maintaining measurement accuracy.
Solution Approach 2:
The printed circuit board's own structure (its thickness, ground planes, and internal routing) provides the thermal shielding function that would otherwise require additional insulating elements. The board serves itself by using its inherent physical properties and design features to isolate the room air temperature sensor from radiator heat, rather than requiring external protective components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables cost-effective manufacturing of the heat cost allocator while ensuring accurate temperature measurements without additional shielding, allowing for efficient thermal coupling and reduced production expenses.
Implementation Method 1
the measuring contacts represent metalized, thermally conductive coupling surfaces for heat conduction to the radiator or room air temperature sensor
Implementation Method 2
a thermally conductive carrier plate that can be mounted on the surface of the radiator
Data Source
Figure 1A~1B
Figure 2
Figure 3~4
AI summary
The allocator has a housing, and a heat conducting carrier plate (4) mounted at a surface of a heating body, where the plate forms a rear wall for the housing. A printed circuit board (1) is arranged in an inner side of the housing and has a heating body temperature sensor (2) and a room air temperature sensor (3). The board has a front surface that faces the carrier plate and comprises a measuring contact for the temperature sensor (2). The board has another front surface with a measuring contact for the temperature sensor (3), where the board is arranged perpendicular to the plate.