Circuit Board Phase Change Heat Dissipation
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Solution Overview
Problem
Existing circuit board heat dissipation methods focus primarily on components rather than the circuit itself, leading to uneven heat dissipation and reliability issues in high-density, high-temperature applications like 5G high-frequency boards, where timely heat management is crucial to prevent overheating and component failure.
Innovation Solution
A circuit board design featuring an insulating substrate with through holes, patterned conductive layers, and embedded phase change material layers that absorb heat through a conductive circuit structure, ensuring uniform temperature distribution and improved stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If phase-change heat-conducting medium is used to wrap circuit board, then heat dissipation of local circuits is improved, but heat dissipation uniformity of overall circuit deteriorates
Solution Approach 1:
The circuit board is divided into multiple independent heat dissipation units, each containing its own phase-change material layer and conductive hole structure. This segmentation allows each unit to independently manage heat from specific circuit regions, ensuring uniform heat dissipation across the entire board while maintaining the effectiveness of phase-change heat dissipation at local levels.
Solution Approach 2:
The phase-change material layer is nested within the conductive hole structure, which is embedded in the circuit board layers. This nested configuration allows the phase-change material to be in direct thermal contact with heat-generating circuits while being contained within a structured framework that distributes heat evenly across the board.
2Temperature
If wave-shaped heat dissipation plate with air circulation space is used, then heat dissipation of inner circuit layer is improved, but space occupation and heat dissipation efficiency deteriorate
Solution Approach 1:
The heat dissipation function is extracted from a bulky wave-shaped plate structure and integrated directly into the circuit board's conductive holes. This eliminates the need for separate air circulation spaces while maintaining effective heat dissipation from inner circuit layers through the phase-change material positioned within the board's existing structural voids.
Solution Approach 2:
The mechanical air circulation system is replaced with a phase-change material-based thermal management system. The phase-change material absorbs and transports heat through phase transition rather than relying on air flow, eliminating the need for large air circulation spaces while improving heat dissipation efficiency.
3Temperature
If embedded metal blocks are used for heat dissipation, then heat dissipation of circuit layer is improved, but weight and flexibility deteriorate
Solution Approach 1:
The heat dissipation approach transitions from using dense metal blocks to using phase-change materials with lower density. This parameter change in material selection maintains effective heat dissipation through phase transition mechanisms while significantly reducing the weight and improving the flexibility of the circuit board.
Solution Approach 2:
The patent uses composite structures combining conductive materials with phase-change materials within the conductive holes. This composite approach provides effective thermal management while maintaining the lightweight and flexible characteristics of the overall circuit board, avoiding the need for heavy embedded metal blocks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedded phase change material effectively reduces heat, enhancing the stability and heat dissipation of the circuit board, making it suitable for high-density and high-frequency applications by maintaining uniform temperature and preventing overheating.
Implementation Method 1
a phase change material layer (30) embedded in the first conductive circuit layer (41) and the second conductive circuit layer (42)
Implementation Method 2
the phase change material layer (30) embedded in the first conductive circuit layer (41) and the second conductive circuit layer (42)... heat generated by the first conductive circuit layer (41) and the second conductive circuit layer (42) is absorbed by the phase change material layer (30)
Implementation Method 3
heat generated by the first conductive circuit layer (41) and the second conductive circuit layer (42) is absorbed by the phase change material layer (30) in the first conductive circuit layer (41) and the second conductive circuit layer (42)
Data Source
AI summary
A method for manufacturing a circuit board includes providing an insulating substrate, defining a through hole in the insulating substrate, forming a first conductive layer on two surfaces of the insulating substrate and on an inner wall of the through hole, forming a phase change material layer on a surface of each first conductive layer, forming a seed layer on a surface of the first conductive layer, forming a second conductive layer on a surface of the seed layer, and etching the seed layer, the first conductive layer, and the second conductive layer, so that a first conductive circuit layer and a second conductive circuit layer are respectively formed on two opposite surfaces of the insulating substrate, so that the phase change material layer is embedded in the first conductive circuit layer and in the second conductive circuit layer. The application also provides a circuit board.