PCB Pinout Power Module Packaging Without Pin Soldering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional plastic-packaged power modules have a large volume and complex pin soldering processes, leading to increased costs, reduced reliability, and thermal shock issues due to the need for separate moldings and reflow soldering techniques.
Innovation Solution
A PCB-pinout based packaged module design where surface-layer copper etching patterns on the PCB expose pins outside the module, allowing for direct communication and eliminating the need for separate pin soldering, thus simplifying the pin disposing process and reducing module volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional plastic packaging with separate pin assembly is used, then the module provides complete packaging protection, but the module volume increases and the pin soldering process becomes complex
Solution Approach 1:
The patent merges the pin assembly process with the plastic packaging process by integrating pins directly into the mold cavity during injection molding. This eliminates the need for separate pin assembly and soldering operations, reducing module volume while maintaining packaging protection through the unified plastic encapsulation structure.
Solution Approach 2:
The plastic packaging material serves multiple functions simultaneously: it provides mechanical protection, electrical insulation, and direct pin integration. The mold cavity design allows the plastic to form both the protective housing and the pin mounting structure, eliminating the need for separate pin assemblies and reducing overall module volume.
2Strength
If reflow soldering is used to assemble pins, then the pins are securely connected, but the module is subject to thermal shock and costs increase
Solution Approach 1:
The patent replaces the thermal reflow soldering process with a mechanical injection molding process. Pins are mechanically integrated into the plastic packaging through the mold cavity, eliminating exposure to thermal shock from reflow soldering while maintaining secure connections through the molded mechanical interlock.
3Manufacturing precision
If separate molds are opened for pin assembly, then the pins can be precisely manufactured, but the processing process becomes complex and costs increase
Solution Approach 1:
The patent combines multiple molding operations into a single injection molding process. The mold cavity is designed to form both the plastic packaging housing and the pin structures simultaneously, eliminating the need for separate pin assembly molds and reducing processing complexity while maintaining manufacturing precision through integrated tooling.
4Reliability
If pins are assembled separately and soldered, then the connection is established, but the assembly process requires special fixtures and increases time consumption
Solution Approach 1:
The patent performs pin integration during the initial injection molding process rather than as a subsequent assembly step. Pins are pre-positioned and integrated into the plastic packaging structure before final module assembly, eliminating the need for special fixtures and reducing assembly time while maintaining connection reliability through the molded joint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a smaller, more reliable, and cost-effective power module with improved power density by eliminating the need for complex pin soldering and reducing module size, while maintaining effective heat dissipation and assembly density.
Implementation Method 1
a copper etching pattern that is exposed outside the packaged module, wherein the power component is communicatively connected to a pin on one side of the first surface or one side of the second surface of the PCB through the copper etching pattern of the PCB
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
This application relates to the field of power supply packaging technologies, and in particular, to a PCB-pinout based packaged module, including a packaged module and a pin exposed outside the packaged module. The packaged module includes a PCB and a power component. The PCB has a first surface and a second surface that are disposed opposite to each other, and the power component is disposed on the first surface or the second surface of the PCB. The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB. The pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module. The packaged module has a small volume, and this avoids a complex pin soldering process after packaging.