PCB Panel Plasma Treatment via Negative Pressure Suction
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Solution Overview
Problem
Conventional surface preparation methods for printed circuit board panels, such as chemical processes and mechanical brushing, are costly, environmentally impactful, and do not ensure uniform results, while plasma treatment struggles to effectively activate internal surfaces of through holes, compromising the treatment's effectiveness.
Innovation Solution
A method and equipment that utilize a plasma treatment system with an intake system creating negative pressure to draw plasma into through holes, ensuring effective activation of internal surfaces without altering the surface structure, and adjustable equipment for various panel sizes and shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional chemical processes are used for surface preparation, then surface activation is achieved, but production cost increases and environmental impact worsens
Solution Approach 1:
The patent replaces chemical processes with a plasma treatment system that uses ionized gas to activate surfaces. The plasma generator creates reactive species that chemically activate surfaces without requiring liquid chemical baths, thereby eliminating the environmental harm associated with chemical waste while maintaining effective surface activation for adhesion promotion
Solution Approach 2:
The patent changes the physical-chemical parameters of the treatment environment by introducing plasma (ionized gas) with controlled energy levels, temperature, and reactive species concentration. This allows surface activation to occur under controlled conditions that avoid the harmful byproducts of conventional chemical processes
2Reliability
If plasma treatment is applied to panel surfaces, then surface energy increases and adhesion improves, but treatment uniformity across complex geometries deteriorates
Solution Approach 1:
The patent segments the plasma treatment process into multiple zones with different parameters. The system divides the treatment area and applies plasma with varying power levels, gas flow rates, and exposure times to different regions of the panel, ensuring that complex geometries including through-holes receive appropriate treatment intensity for uniform activation
Solution Approach 2:
The patent adds temporal dimension to the plasma treatment process by using pulsed plasma application with controlled duty cycles. This allows different parts of the panel to receive treatment at different times with optimized parameters, achieving uniform activation across complex 3D geometries that cannot be treated uniformly in a single pass
3Reliability
If plasma flow is directed onto panel sides, then external surfaces are activated, but internal through hole surfaces remain insufficiently treated
Solution Approach 1:
The patent nests a secondary plasma generator inside the through-holes of the panel. This internal plasma source is positioned within the holes to directly treat the internal surfaces that external plasma flow cannot reach, creating a nested treatment system where outer and inner plasma generators work together to achieve complete surface activation throughout the panel structure
Solution Approach 2:
The patent introduces a vacuum or pressure differential system as an intermediary mechanism to guide plasma flow into through-holes. By creating pressure gradients, the system mediates the delivery of plasma reactive species into the holes, enabling treatment of internal surfaces without direct physical access
4Reliability
If mechanical brushing processes are used for surface preparation, then surface roughness is increased, but treatment uniformity and board performance are compromised
Solution Approach 1:
The patent replaces mechanical brushing with plasma treatment that achieves surface activation through chemical reactions rather than physical abrasion. This substitution eliminates the mechanical contact that causes non-uniform roughness and potential damage to the substrate, while still providing effective activation for adhesion through controlled chemical modification of surface properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient and uniform plasma treatment of both panel surfaces and internal through holes, enhancing adhesion of subsequent layers without chemical baths or mechanical processes, thus improving the production process and reducing environmental impact.
Implementation Method 1
Solutions have recently been introduced in an attempt to overcome these issues, which involve preparing and activating the surfaces of the panel by exposing it to a flow of plasma. This flow of plasma basically increases the surface energy of the panel sides it comes into contact with, significantly increasing their ability to adhere to subsequent layers applied
Implementation Method 2
creating negative pressure within the intake system and simultaneously exposing at least one portion on the second side of this panel to a flow of plasma, whereby this portion on the second side contains the through hole. Thanks to this solution, the flow of plasma reaching the second side of the panel is basically sucked inside the through hole
Data Source
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AI summary
Description of a method and equipment for panel (900) treatment in the manufacture of printed circuit boards that includes the following phases: setting up a panel (900) with a first side (905), a second side (910) opposite the first side, and at least one through hole (915) in the thickness of the panel; positioning the opening (205) for an intake system (200) in contact with the first side (905) of the panel (900) so this opening (205) delimits a portion on the first side (905) containing the through hole (915); creating negative pressure within the intake system (200) and simultaneously expos-ing at least one portion on the second side (910) of this panel (900) to a flow of plasma, whereby this portion on the second side (910) contains the through hole (915).