Thermally Conductive Plastic Housing for PCB Heat Dissipation
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Solution Overview
Problem
Existing electrical devices face challenges in efficiently dissipating heat from power semiconductor switches and protecting mechanical components during production and environmental concerns, such as complex assembly and high repair costs.
Innovation Solution
A plastic body encases a printed circuit board with heat-generating components, providing mechanical protection and improved heat dissipation through thermal conductivity, allowing for reusable housing parts and simplified production and repair processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal paste is introduced to improve heat transfer, then heat dissipation is improved, but device complexity and environmental concerns increase
Solution Approach 1:
The invention extracts and eliminates the need for thermal paste by using the housing structure itself as the heat dissipation medium. The housing is designed with thermally conductive material and specific geometric features (protrusions, recesses, channels) that directly contact and conduct heat away from power electronic components, removing the requirement for additional thermal interface materials.
Solution Approach 2:
The housing serves multiple functions simultaneously: it provides mechanical protection for internal components, structural support for the device, and acts as a heat sink for thermal management. This multi-functionality eliminates the need for separate dedicated heat dissipation components or thermal paste applications.
2Strength
If the printed circuit board is built into the housing, then mechanical protection is improved, but repairability and environmental protection deteriorate
Solution Approach 1:
The invention segments the device into distinct modular components: a removable printed circuit board assembly and a permanent housing. The housing contains integrated support structures and mounting features that allow the circuit board to be easily inserted and removed without damaging the housing, enabling simple repair and replacement while maintaining strong mechanical protection during operation.
3Ease of manufacture
If protruding components are left exposed, then ease of manufacture is improved, but mechanical protection and stability deteriorate
Solution Approach 1:
The housing is designed with pre-formed protrusions and recesses that align with corresponding features on the printed circuit board components. This preliminary structural preparation ensures that components are automatically positioned and mechanically protected upon assembly, eliminating the need for additional mounting operations while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances mechanical protection, facilitates safe transport and storage, reduces repair costs, and improves thermal conductivity, enabling efficient heat dissipation without the need for additional thermal paste, while allowing for automated production and versatile housing designs.
Implementation Method 1
With a heat-conducting design of the plastic body, improved heat dissipation of the heat-generating components can also be achieved
Data Source
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AI summary
The invention relates to an electrical device comprising a printed circuit board which is equipped with heat generating components, wherein the printed circuit board is arranged in a housing of the device, wherein a plastic body is arranged on both sides of the printed circuit board and is connected to the populated printed circuit board, in particular by bonding and/or positive fit.