PCB Plating Bar for ESD Protection in Non-Plating Process
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Solution Overview
Problem
In the integrated circuit industry, printed circuit boards fabricated by non-plating processes are prone to damage from electrostatic discharge during the wiring process of Multi Stacked-Die Packaging due to the lack of effective grounding and voltage distribution for signal lines.
Innovation Solution
The printed circuit board is designed with a non-plating process that includes forming ground lines and power lines connected to a plating bar, with signal lines also connected to the plating bar through ground and power lines, allowing for electrostatic discharge protection and efficient voltage distribution across the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a non-plating process is used to fabricate the printed circuit board, then manufacturing cost and complexity are reduced, but the board becomes vulnerable to electrostatic discharge damage during wiring
Solution Approach 1:
The patent applies preliminary action by pre-forming ground lines and power lines during the non-plating manufacturing process, before the actual wiring operations take place. These protective lines are embedded into the board structure in advance, creating a safeguard against electrostatic discharge that will occur during subsequent wiring operations. The ground lines are specifically positioned to provide electrostatic discharge pathways before any wiring damage can occur.
2Reliability
If ground lines and power lines are added to provide electrostatic discharge protection, then reliability improves, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the ground lines and power lines. These lines simultaneously serve as electrical conductors for power and ground signals, as electrostatic discharge protection pathways, and as structural elements of the circuit board. By combining these functions into unified line structures rather than adding separate protective components, the patent reduces overall device complexity while maintaining reliability.
Solution Approach 2:
The ground lines and power lines are designed to perform multiple functions: they provide electrical connectivity for their primary signal purposes, serve as electrostatic discharge protection pathways, and act as reference planes for signal integrity. This multi-functionality eliminates the need for separate dedicated protection structures, thereby reducing device complexity while achieving reliable electrostatic discharge protection.
Data Source
AI summary
The present invention provides a printed circuit board fabricated by a Non-Plating Process that includes at least one plating bar disposed around at least one package unit of the printed circuit board. The package unit includes at least one ground line, at least one power line and a plurality of signal lines. The ground line has a first contact pad exposed on a surface of the printed circuit board, and at least one of the ground lines is connected to the plating bar. The power line has a second contact pad exposed on the surface, and at least one of the power lines is connected to the neighboring plating bar. The signal line has a third contact pad exposed on the surface.