Plating Lead Wire Resonance Suppression in PCB Manufacturing
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Solution Overview
Problem
In printed circuit board manufacturing, lead wires for plating cause resonance that attenuates electrical signal frequencies, leading to a blunt waveform, and removing them increases manufacturing costs.
Innovation Solution
The lead wire for plating is designed with varying widths or branched into multiple portions to adjust its resonance frequency, either lower or higher than the signal frequency, without altering its length, to minimize the impact on the electrical signal waveform.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If lead wires for plating are removed after electrolytic plating, then the harmful resonance effects are eliminated, but manufacturing cost increases due to additional removal process
Solution Approach 1:
The patent changes the geometric parameters (width and shape) of the lead wire for plating to modify its resonance frequency. By making the lead wire narrower in the middle portion and wider at the ends, or by adding notches and grooves, the resonance frequency is shifted away from the signal frequency range, eliminating harmful resonance effects while keeping the lead wire in place after plating.
Solution Approach 2:
The patent converts the potentially harmful resonance property of the lead wire into a beneficial effect by carefully designing its geometry to shift the resonance frequency to a useful range or to eliminate resonance in the signal frequency range. The lead wire's structural features (notches, grooves, varying width) are designed to create resonance at frequencies that do not interfere with the electrical signal transmission.
2Ease of manufacture
If lead wires for plating are kept after electrolytic plating, then manufacturing cost is reduced, but resonance occurs at particular frequencies causing signal attenuation
Solution Approach 1:
The patent modifies the physical parameters of the lead wire (width, shape, cross-section) to change its electrical characteristics. By making the lead wire non-uniform in width or adding structural features like notches and grooves, the resonance frequency is shifted away from the operating signal frequency, allowing the lead wire to remain without causing signal attenuation.
Solution Approach 2:
The patent segments the lead wire into different portions with different characteristics (narrower middle portion, wider ends) or adds segmented features like notches and grooves. This segmentation creates multiple resonance frequencies that are distributed away from the signal frequency, reducing the likelihood of resonance interference while maintaining the lead wire's structural integrity and electrical function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses the blunt waveform caused by resonance in the lead wires for plating, maintaining signal integrity while avoiding additional manufacturing steps and costs.
Implementation Method 1
the lead wire for plating includes a first linear portion provided to extend from the wiring trace and having a first width, and a second linear portion provided to extend from the first linear portion and having a second width that is different from the first width. When an electrical signal is transmitted through the wiring trace, a resonance frequency in the lead wire for plating is increased or decreased because the first width of the first linear portion and the second width of the second linear portion are different in the lead wire for plating.
Data Source
AI summary
A plurality of wiring traces and a plurality of lead wires for plating are formed on a base insulating layer. Each wiring trace and each lead wire for plating are integrally formed with each other. An electrode pad is provided at an end of each wiring trace, and the lead wire for plating is provided to extend from each electrode pad toward the opposite side to the wiring trace. A width of each lead wire for plating is set larger than a width of each wiring trace.