Memory Card PCB Unified Plating Process
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Solution Overview
Problem
The conventional manufacturing process for printed circuit boards in memory cards requires separate gold plating processes for terminal and mounting units, leading to inefficiencies in economics and productivity due to differing properties and the need for multiple exposure, development, and dry film removal processes.
Innovation Solution
A surface treatment method is introduced where both the terminal and mounting units on the printed circuit board are plated with the same metal material, using a nickel metal layer, a palladium metal layer, and a gold plated layer, allowing for simultaneous processing and reducing the thickness of the gold plated layer, thereby enhancing soldering, wire bonding, and wear resistance properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate gold plating processes are performed for terminal and mounting units, then different physical properties can be achieved, but manufacturing complexity and process time increase
Solution Approach 1:
The patent combines separate gold plating processes into a single simultaneous plating operation. The terminal unit and mounting unit are plated together in one process step, eliminating the need for multiple separate exposure and development processes while achieving the desired physical properties for each component.
Solution Approach 2:
The patent employs a universal plating solution that can simultaneously provide different physical properties to different components. The same plating process serves both the terminal unit (requiring wear resistance) and mounting unit (requiring soldering ability), making the process multi-functional and efficient.
2Manufacturing precision
If multiple exposure and development processes are used, then different patterns can be formed, but productivity decreases
Solution Approach 1:
The patent merges multiple exposure and development processes into a single operation. By applying the plating solution simultaneously to both terminal and mounting units in one process step, the patent eliminates repeated exposure and development cycles, significantly improving productivity while maintaining precise pattern formation.
3Loss of substance
If gold thickness is reduced, then material costs decrease, but wear resistance and bonding ability may be compromised
Solution Approach 1:
The patent changes the parameters of the plating solution and process to achieve optimal results with reduced gold thickness. By adjusting plating conditions and using enhanced plating solutions, the patent maintains adequate wear resistance and bonding ability even with thinner gold layers, reducing material consumption while preserving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, reduces material costs, and achieves the desired properties of hardness, wire bonding ability, and wear resistance while applying to various substrates, including general printed circuit boards.
Implementation Method 1
forming surface-treated metal layers by plating the surfaces of the mounting unit and the terminal unit with the same metal material
Data Source
AI summary
The printed circuit board for the memory card includes an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.