PCB Plating Lead-in Relocation for Battery Terminals
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Solution Overview
Problem
Conventional rechargeable battery PCBs often have residual plating lead-in lines around external contact terminals, leading to potential short-circuits and defective appearances due to incomplete removal of these lines during the manufacturing process.
Innovation Solution
The method involves forming plating lead-in lines on the internal surface of the PCB, connected to external contact terminals through conductive traces, allowing for complete removal of these lines after plating, ensuring the external contact terminals are free of vestigial plating lead-in lines and reducing the risk of short-circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plating lead-in lines are formed on the external surface of the PCB for plating the external contact terminal, then the external contact terminal can be plated, but residual plating lead-in lines remain around the terminal causing short-circuits and defective appearances
Solution Approach 1:
The plating lead-in lines are extracted from the external surface and relocated to the internal surface of the PCB. The conductive trace serves as the connection path, allowing the plating lead-in lines to be completely removed from the external surface after plating, eliminating residual lines that cause short-circuits and appearance defects.
Solution Approach 2:
The plating lead-in lines are moved from the two-dimensional external surface to the internal surface of the PCB, utilizing the third dimension (depth/thickness) of the PCB structure. This dimensional transition allows complete removal of lead-in lines from the external surface while maintaining electrical connection through conductive traces.
2Manufacturing precision
If plating lead-in lines are formed on the external surface of the PCB, then the external contact terminal can be plated, but the appearance becomes defective due to residual lines
Solution Approach 1:
The plating lead-in lines are extracted from the external surface and relocated to the internal surface of the PCB. After plating, the lead-in lines are completely removed from the external surface, eliminating visual defects and ensuring a clean, professional appearance of the external contact terminal.
3Reliability
If plating lead-in lines are formed on the internal surface of the PCB, then residual lines are eliminated, but the manufacturing process becomes more complex
Solution Approach 1:
The manufacturing process utilizes the internal surface of the PCB by forming plating lead-in lines on the opposite side from the external contact terminal. This dimensional approach simplifies the overall process by eliminating the need for selective removal of lead-in lines, as they are naturally positioned away from the external surface where they would cause defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents short-circuits and maintains a clean appearance by eliminating residual plating lead-in lines, enhancing the reliability and aesthetics of the rechargeable battery's external contact terminals.
Implementation Method 1
plating the external contact terminal by electrically connecting a plating electrode to the conductive feature
Data Source
AI summary
A method of fabricating a rechargeable battery having an electrode assembly, a PCB and a battery case, wherein the electrode assembly is connected to the PCB, the method including preparing a PCB having a first surface with an external contact terminal formed thereon and having a second surface with a conductive feature formed thereon, wherein the conductive feature is electrically connected to the external contact terminal through a conductive trace, and plating the external contact terminal by electrically connecting a plating electrode to the conductive feature.