Multi-Layer PCB Power Converter Cooling for Higher Power Density
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Solution Overview
Problem
Power converters face challenges in thermal dissipation due to decreased surface area and increased heat loss as they shrink in size, requiring improved cooling mechanisms to maintain thermal performance while minimizing device volume.
Innovation Solution
The Integrated Multi-Layer Cooling (IMLC) structure, which involves vertically stacking multiple printed circuit boards (PCBs) connected by copper rods and utilizing a liquid cooling mechanism, specifically a cold plate heatsink, to actively cool high-loss components and passively cool low-loss components, optimizing thermal dissipation and reducing device volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the overall size of the converter and individual electronic components decrease, then the power density increases, but the surface area available to dissipate heat decreases and the loss of components increases
Solution Approach 1:
The patent transitions from traditional single-layer PCB cooling to multi-layer PCB stacking with vertical heat transfer paths. Multiple PCBs are stacked vertically with heatsinks attached to both top and bottom surfaces, creating three-dimensional heat dissipation pathways that increase cooling efficiency without increasing the horizontal footprint of the device.
Solution Approach 2:
The converter is divided into multiple separate PCB layers, each capable of independent cooling. High-loss components are segmented and distributed across different PCB layers, allowing targeted cooling strategies for different component groups. This segmentation enables parallel heat dissipation paths and improves overall thermal management efficiency.
2Temperature
If high loss circuitry components are concentrated on one side of the PCB for active cooling, then thermal performance improves, but device complexity increases due to multi-layer PCB structure
Solution Approach 1:
The device is segmented into multiple PCB layers with distinct functional zones. High-loss circuitry components are concentrated on specific PCBs (particularly the bottom PCB) that are directly coupled to active cooling mechanisms, while low-loss components are placed on other PCBs. This segmentation allows optimized thermal management for each component type without requiring complex cooling systems for the entire device.
Solution Approach 2:
Different PCB layers are assigned different cooling qualities based on their component heat generation characteristics. PCBs with high-loss components receive active liquid cooling through integrated cold plates, while PCBs with low-loss components may use passive cooling or air cooling. This local differentiation of cooling quality optimizes thermal performance while minimizing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The IMLC structure achieves 31% greater power density with reduced converter size, maintaining thermal performance by efficiently using three-dimensional space and sorting components by heat generation, while actively cooling high-loss components and passively cooling low-loss ones.
Implementation Method 1
The liquid cooling mechanism is operable to actively cool at least the high loss circuitry components mounted to the first PCB
Implementation Method 2
a liquid cooling mechanism mounted to the first PCB... actively cool at least the high loss circuitry components
Implementation Method 3
the connector rods are copper and electrically connect the first PCB to the second PCB
Data Source
AI summary
A power converter includes an integrated multi-layer cooling structure. The power converter includes a plurality of printed circuit boards (PCBs) stacked together in a generally vertical arrangement. A liquid cooling mechanism is attached to a lower-most PCB, and high loss circuitry components are attached to an opposite side of the lower-most PCB. Low loss circuitry components are attached to further PCBs. Magnetic components may be attached to the further PCBs. The high loss components are actively cooled by the liquid cooling mechanism and the low loss components and magnetic components are passively cooled. The liquid cooling mechanism may be a cold plate heatsink. The power converter may include intermediate PCBs disposed between the upper-most PCB and the lower-most PCB, with low loss circuitry components attached to the intermediate PCBs.