Thermally Conductive PCB Layer for Simultaneous Power and Cooling

The patent combines the power supply function and cooling function into a single integrated element. The first layer serves dual purposes: it conducts electricity to supply power to electronic components while simultaneously conducting heat away from them. This merging eliminates the need for separate power supply traces and cooling structures, thereby reducing device complexity while maintaining functional reliability.

The first layer of the cooling module is designed to perform multiple functions simultaneously. It acts as both an electrical conductor for power distribution and a thermal conductor for heat dissipation. This multi-functionality allows a single element to replace what would traditionally require separate components, reducing overall system complexity.

The patent converts the harmful heat generated by high-power electronic components into a manageable thermal flow. The first layer is positioned to receive heat directly from the components and conduct it to the second layer, which dissipates the heat. This approach transforms the unwanted byproduct of high computational power into a controlled thermal management process, enabling sustained high performance without excessive temperature rise.

The cooling module with its two-layer structure acts as an intermediary between the heat-generating electronic components and the external environment. The first layer collects heat at the source, the intermediate structure (with thermal insulation) prevents heat spread to unwanted areas, and the second layer dissipates heat to the surroundings. This intermediary system enables high power operation by mediating the heat transfer process.