PCB Power Inlet Mounting With Flat Leads and Fastening Support
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Solution Overview
Problem
Existing power supply boards in electronic devices, such as display devices, face issues with increased thickness due to protruding power inlet leads and potential damage from excessive force removal, compromising safety.
Innovation Solution
A power inlet design with multiple cord coupling portions, partitioned by walls, and a fastening mechanism that secures terminals without protrusion, using a fastening support soldered to the circuit board, ensuring proper alignment and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the power inlet lead penetrates the substrate and protrudes from the substrate, then the power inlet can be mounted on the substrate, but the thickness of the power supply board increases
Solution Approach 1:
The patent transitions from a protruding three-dimensional structure to a planar two-dimensional structure by routing the power inlet lead through the substrate thickness direction and bending it back to lie flat on the substrate surface, thereby eliminating thickness increase while maintaining mounting capability
Solution Approach 2:
The lead structure utilizes flexible routing that bends and conforms to the substrate surface, allowing the lead to be mounted effectively without adding thickness, transforming a rigid protruding structure into a flexible planar configuration
2Ease of manufacture
If the power inlet lead penetrates the substrate and protrudes from the substrate, then the power inlet can be mounted on the substrate, but the power inlet may be damaged or depart from the substrate when separated with excessive force
Solution Approach 1:
The patent applies preliminary reinforcement by soldering the lead to the substrate before final assembly, creating a strong bonding interface that prevents damage or detachment under excessive force, thereby cushioning against potential failure modes
Solution Approach 2:
The lead incorporates a curved or bent configuration rather than a straight protruding structure, which distributes mechanical stress more effectively and reduces the risk of brittle failure when force is applied during separation or handling
3Adaptability or versatility
If multiple terminals are provided in the power inlet, then power connection functionality is improved, but interference between terminals may occur without proper partitioning
Solution Approach 1:
The patent divides the power inlet structure into distinct partitioned sections, with each terminal housed in its own isolated compartment, thereby preventing electromagnetic interference between terminals while maintaining multiple connection functions
Solution Approach 2:
The patent arranges multiple terminals in a planar distribution pattern on the substrate surface rather than stacking them vertically, spacing them apart in two dimensions to eliminate interference while preserving full power connection capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces the thickness of the power supply board and enhances safety by preventing damage and interference between terminals, while maintaining efficient power connection.
Implementation Method 1
a first fastening support soldered on the printed circuit board and configured to fix the first fixing portion on the printed circuit board
Data Source
AI summary
An electronic device including a printed circuit board and a power inlet provided on the printed circuit board. The power inlet includes a first terminals a second terminal at a first side of the first terminal, and a third terminal at a second side of the first terminal. The second side is opposite to the first side. A first fixing portion is fixed on the printed circuit board by a fastening member. A first fastening support is soldered on the printed circuit board and fixes the first fixing portion on the printed circuit board.