PCB Power Module Layout Using Magnetic Components for Heat Dissipation
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Solution Overview
Problem
Existing power supply devices, such as switching mode power supplies, face challenges in reducing size and improving heat dissipation, especially in sealed environments where air flow is limited.
Innovation Solution
A power supply device is mounted on a mainboard with a magnetic device located above the mainboard and thermally coupled with a semiconductor device through a thermally conductive portion, allowing for efficient heat dissipation and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the magnetic component is mounted above the switching components and control components with pins for electrical connection, then the power module structure is simplified and ease of manufacture is improved, but the heat dissipation performance deteriorates because heat can only be removed by air flow and natural convection
Solution Approach 1:
The patent merges the magnetic component and semiconductor device into a single integrated package structure. The magnetic component is positioned above the semiconductor device with direct thermal coupling through the package substrate, combining both electrical and thermal functions in one unit. This integration allows heat to be conducted directly from the semiconductor device through the package substrate to the magnetic component and then to the PCB board, eliminating the need for separate heat dissipation structures.
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it provides electrical connection between the semiconductor device and PCB through soldering leads, provides thermal conduction path for heat dissipation, and provides mechanical support and structural integration. The magnetic component also serves dual purposes by being both the functional magnetic element and part of the heat dissipation pathway.
2Volume of moving object
If all components are integrated into one packaging piece to reduce size, then the volume is reduced, but the manufacturing cost significantly increases as in the sealed chip package scheme
Solution Approach 1:
The patent implements a nested structure where the semiconductor device is positioned below the magnetic component within the same package footprint. The semiconductor device package is essentially nested within the overall magnetic component assembly area, maximizing space utilization. The soldering leads from the semiconductor device pass through or alongside the magnetic component structure, allowing both components to occupy overlapping or adjacent spatial volumes, thereby reducing the total device footprint while using standard manufacturing processes.
3Temperature
If the semiconductor device is thermally coupled with the magnetic device, then the heat dissipation path is improved and temperature is reduced, but the device complexity increases due to additional thermal coupling structures
Solution Approach 1:
The package substrate itself serves as the thermal conduction pathway without requiring separate thermal interface materials or additional heat sink structures. The natural thermal gradient from the hot semiconductor device through the substrate to the cooler magnetic component and PCB creates a self-driven heat dissipation system. The existing structural elements (substrate, soldering leads, magnetic component mounting structure) automatically perform the thermal management function as part of their primary roles, eliminating the need for dedicated thermal management components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the size of power supply devices and improves heat dissipation by utilizing the magnetic device as a heat sink and providing multiple paths for heat dissipation, even in sealed environments.
Implementation Method 1
a first thermally conductive portion located in the at least one accommodating portion, and the semiconductor device is thermally coupled with the magnetic device by the first thermally conductive portion
Data Source
AI summary
A power supply device (20, 20′, 20″) and a printed circuit board device (100, 100′, 100″) including the same are provided in embodiments of the present disclosure. The power supply device (20, 20′, 20″) is mounted on a mainboard (10) and includes a first surface (11). The power supply device (20, 20′, 20″) includes: a magnetic device (22) located above the first surface (11) of the mainboard (10) and electrically connected to the mainboard (10); at least one accommodating portion (24) located on a surface of the magnetic device (22) facing towards the first surface (11); and a semiconductor device (26) which is at least partially accommodated in the at least one accommodating portion (24) and electrically connected to the mainboard (10).