PCB Power Supply Layout With Nested Magnetic-Semiconductor Cooling

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Solution Overview

Problem

Existing power supply devices, particularly switching mode power supplies, face challenges in reducing size and improving heat dissipation, especially in sealed environments where air flow is limited, leading to poor heat dissipation and increased costs with integrated solutions.

Innovation Solution

A power supply device design where a semiconductor device is partially accommodated in an accommodating portion of the magnetic device, with thermal and electrical connections through a mainboard, allowing for dual heat dissipation paths and reduced size without additional packaging or soldering leads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the magnetic device is mounted above the switching components and control components on the mainboard, then the power module structure is formed, but the heat dissipation becomes poor in sealed environments and the size is not sufficiently small

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidpower module size

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The semiconductor device is nested within the accommodating portion of the magnetic device, with the semiconductor device partially inserted into the magnetic device's accommodating portion. This nesting arrangement allows the semiconductor device to be housed within the magnetic device's structure, reducing overall power module size while enabling direct thermal contact between the semiconductor device and magnetic device for improved heat dissipation.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The magnetic device serves dual functions as both a magnetic component and a heat dissipation structure. The accommodating portion of the magnetic device is designed to house the semiconductor device, merging the magnetic function and heat dissipation function into a single integrated component, thereby reducing the need for separate heat sinks and reducing overall size.

Inventive Principle:

Principle #5Merging (Combining)

2Volume of stationary object

If all components are integrated into one packaging piece, then the size is reduced, but the cost significantly increases and high voltage applications are limited

Engineering Contradiction:

Improvepower module sizeVSAvoidmanufacturing cost

Core Design Contradiction:

Volume of stationary objectVSEase of manufacture

Solution Approach 1:

The power supply device is segmented into distinct functional modules: the magnetic device with its accommodating portion, the semiconductor device, and the mainboard. These modules are separately manufactured and then assembled by inserting the semiconductor device into the magnetic device's accommodating portion and mounting the assembly on the mainboard. This segmentation allows each component to be optimized independently while maintaining a compact overall structure, avoiding the high costs associated with fully integrated packaging.

Inventive Principle:

Principle #1Segmentation

3Device complexity

If the semiconductor device is mounted on the mainboard without accommodation, then the structure is simple, but the heat dissipation path is limited and size reduction is insufficient

Engineering Contradiction:

Improvestructural complexityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The semiconductor device is partially inserted into the accommodating portion of the magnetic device rather than being fully enclosed or requiring complex integration. This partial accommodation provides sufficient thermal contact between the semiconductor device and magnetic device for effective heat dissipation while maintaining structural simplicity and avoiding excessive manufacturing complexity.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively reduces the size of power supply devices while enhancing heat dissipation, utilizing the magnetic device as a heat sink and maintaining electrical connections through the mainboard, thus addressing size and heat dissipation limitations in existing technologies.

Implementation Method 1

a first heat dissipation path from the semiconductor device to the magnetic device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

thermal and electrical connections through a mainboard

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3731390B1Power supply device and printed circuit board device comprising same

Publication Date: 2023.11.08 TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)

Figure 1A~1B
Figure 2A~2B
Figure 2C~3

AI summary

A power supply device (20, 20', 20") and a printed circuit board device (100, 100', 100") including the same are provided in embodiments of the present disclosure. The power supply device (20, 20', 20") is mounted on a mainboard (10) and includes a first surface (11). The power supply device (20 , 20', 20") includes: a magnetic device (22) located above the first surface (11) of the mainboard (10) and electrically connected to the mainboard (10); at least one accommodating portion (24) located on a surface of the magnetic device (22) facing towards the first surface (11); and a semiconductor device (26) which is at least partially accommodated in the at least one accommodating portion (24) and electrically connected to the mainboard (10).