PCB Power Tab Slot Connection for High Current
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Solution Overview
Problem
Existing circuit board assemblies struggle to efficiently transfer high currents (>3 amps) while minimizing heat generation and maintaining cost-effectiveness, as most right angle connectors are inadequate for large current carrying and custom copper tabs are costly.
Innovation Solution
A method involving a first printed circuit board with copper pads having slots and a second printed circuit board with power tabs that are slid through the slots, flooded with copper, and soldered to create a robust and efficient electrical connection between the two boards, eliminating the need for additional connections and reducing heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a right angle connector is used to connect the main board with the connector board, then the connection is simple and standard, but it is not capable of carrying large amounts of current
Solution Approach 1:
The connection structure is segmented into multiple power tabs distributed across the connector board, each tab providing a parallel current path. This segmentation increases total current carrying capability while using standard PCB manufacturing processes
Solution Approach 2:
Multiple power tabs are merged into a single connector assembly, creating a composite connection structure that combines multiple current paths into one integrated solution, achieving high current capacity without complex external components
2Reliability
If a custom made copper tab is used to provide connection between main board and connector board, then current carrying capability is improved, but manufacturing cost becomes extremely costly
Solution Approach 1:
The power tabs are designed as multi-functional elements that serve both as electrical current carriers and as mechanical connection points. They are integrated into the standard PCB layout, eliminating the need for separate custom copper tabs while achieving both electrical and mechanical functions
Solution Approach 2:
The PCB manufacturing process itself creates the current-carrying power tabs through standard copper trace and pad processes. The PCB structure serves its own electrical connection function without requiring external custom-made components, reducing manufacturing complexity and cost
3Power
If large amount of current is passed between main board and connector board, then power management capability is improved, but heat generation increases
Solution Approach 1:
The current path is segmented into multiple parallel power tabs, distributing the total current across several conductors. This reduces current density in each individual tab, thereby reducing resistive heating (I²R losses) while maintaining total power management capability
Solution Approach 2:
The power tabs are strategically positioned and sized with appropriate copper thickness and trace width in high-current regions. This local optimization of conductor quality minimizes resistance and heat generation at critical connection points where current density is highest
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables cost-effective and efficient transfer of high currents with minimal heat generation, achieving the objectives of high current carrying capacity and cost savings by using a mortise and tenon type connection between the printed circuit boards.
Implementation Method 1
Finally, the power tabs are soldered to the copper pads to finalize the connection between the first and second printed circuit boards
Implementation Method 2
The plurality of power tabs are then flooded with copper to the edge of the second printed circuit board to maximize current carrying capability between the first printed circuit board and the second printed circuit board
Data Source
AI summary
A method of manufacturing a circuit board assembly for a controller. The method includes providing first and second printed circuit boards wherein the first printed circuit board has a plurality of copper pads containing slots therein that correspond to a plurality of power tabs in the second printed circuit board. The power tabs are then slid into the slots and the tabs are flooded with copper. At this time the power tabs are soldered within the slots to provide an electrical connection between the first and second printed circuit boards that allows for the transfer of current between the boards of more than three amps.