PCB Prepreg Drilling and Plating Resist Ink Filling for Short-Line Effect
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Solution Overview
Problem
The existing methods for manufacturing Printed Circuit Boards (PCBs) fail to completely eliminate the short-line effect, leading to signal interference and increased bit error rates due to incomplete removal of parasitic capacitance and inductance, resulting in reduced yield and increased manufacturing costs.
Innovation Solution
A method involving drilling target prepregs to form holes with larger apertures than necessary, filling these holes with plating resist ink to prevent conductive material deposition, and laminating the PCB to create insulating portions within the through holes, thereby eliminating the short-line effect and preventing signal attenuation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If back drilling is used to remove the short line, then the short line is partially removed, but the short-line effect cannot be completely eliminated and the functional portions of the through hole may be damaged
Solution Approach 1:
The patent applies preliminary action by forming a larger aperture hole in advance at the position of the preset hole before the lamination process. This pre-formed hole provides sufficient space to accommodate the short line removal operation afterward, ensuring that the functional portions of the through hole are not damaged while completely eliminating the short-line effect.
Solution Approach 2:
The patent segments the through hole formation process into two distinct stages: first forming a larger aperture hole in the target prepreg before lamination, and then forming the final through hole after lamination. This segmentation allows the short line to be completely removed without affecting the functional portions of the through hole, as the larger initial aperture provides the necessary space.
2Object-generated harmful factors
If a drilling tool with pointed tip is used for back drilling, then the short line can be accessed, but the drilling tool lacks accuracy and may damage functional portions of the through hole
Solution Approach 1:
The patent applies preliminary action by forming a larger aperture hole in advance at the position of the preset hole before the lamination process. This pre-formed hole provides sufficient space to accommodate the short line removal operation afterward, ensuring that the functional portions of the through hole are not damaged while completely eliminating the short-line effect.
Solution Approach 2:
The larger aperture hole acts as an intermediary structure that facilitates the complete removal of the short line without directly impacting the functional portions of the through hole. This intermediary hole provides the necessary space and access for the short line removal operation while preserving the integrity of the functional through hole.
3Object-generated harmful factors
If the aperture of the drilled hole is made larger than the preset hole, then the short line can be completely removed, but more material is removed from the prepreg
Solution Approach 1:
The patent applies local quality by making the aperture of the drilled hole larger than the preset hole only in the target prepreg where the short line exists, while maintaining the original hole size in other areas. This localized enlargement allows complete short line removal without unnecessarily removing material from the entire PCB structure, thus minimizing material loss while effectively eliminating the harmful short-line effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively eliminates the short-line effect, ensuring signal integrity and reducing manufacturing costs by improving the accuracy of the PCB production process.
Implementation Method 1
filling the formed through hole with a plating resist ink to prevent the through holes from being plated with a conductive material
Implementation Method 2
drilling a target prepreg at a position corresponding to at least one preset hole therein so as to form a hole perforating through the target prepreg
Implementation Method 3
laminating the target prepreg and core boards so as to form a multi-layer printed circuit board PCB
Data Source
AI summary
Embodiments of the present application relate to the technical field of a printed circuit plate, in particular, to a printed circuit plate and a method manufacturing same so as to resolve a problem of an incomplete elimination of a short-line effect. The method for manufacturing a printed circuit board in the embodiments of the present application comprises a step of drilling target prepregs at positions corresponding to at least one preset hole therein so as to form through holes perforating through the target prepregs, wherein the formed through holes have an aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB. The method further comprises: filling the formed through holes with a plating resist ink to prevent the through holes from being plated with a conductive material; laminating the target prepregs and core boards so as to form a multi-layer printed circuit board PCB, wherein some or all of the prepregs are the target prepregs; drilling the multi-layer PCB to perforate the preset holes in the target prepregs; and plating inner walls of holes formed by drilling the multi-layer PCB.