PCB Prepreg Resin Composition for Uniform Filler-Rich Insulation Layers
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Solution Overview
Problem
Conventional prepregs and copper clad laminates for semiconductor packages face separation issues between resin and inorganic fillers during high-temperature and high-pressure lamination, leading to non-uniform insulation layers and compromised physical properties like heat resistance and reliability.
Innovation Solution
A thermosetting resin composition comprising bismaleimide-triazine or cyanate-based resins, epoxy resins, and a multi-functional phenolic resin as a curing agent, along with an inorganic filler, which inhibits separation by controlling flowability through a specific curing process, allowing for the use of high inorganic filler content without separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a larger amount of inorganic filler (50% or more) is used relative to resin to achieve high heat resistance and low CTE, then physical properties are improved, but separation between resin and inorganic filler occurs during high-temperature and high-pressure lamination
Solution Approach 1:
The patent changes the chemical composition parameters of the resin system by combining BT resin (10-55 wt%), epoxy resin (35-80 wt%), and multi-functional phenolic resin (5-15 wt%). This parameter change enables the resin to maintain appropriate flowability and adhesion during lamination while achieving high heat resistance and low CTE with 50% or more inorganic filler content.
Solution Approach 2:
The patent creates a composite resin system by combining three different resin types (BT resin, epoxy resin, and multi-functional phenolic resin) with inorganic filler. This composite material approach allows the resin mixture to exhibit both good flowability for preventing separation and high heat resistance, resolving the contradiction between maintaining composition stability and achieving desired physical properties.
2Reliability
If conventional BT resin and epoxy resin are used with inorganic filler content of 50% or more, then heat resistance is improved, but flowability becomes poor during heating and pressing
Solution Approach 1:
The patent modifies the resin system composition by introducing multi-functional phenolic resin (5-15 wt%) with specific hydroxyl equivalent weight (100-300) to the BT resin-epoxy resin system. This parameter change optimizes the flowability of the resin during high-temperature and high-pressure lamination while maintaining the heat resistance provided by the BT resin and inorganic filler.
Solution Approach 2:
The multi-functional phenolic resin acts as an intermediary component that mediates between the flowability requirements and heat resistance requirements. It enhances the overall performance of the resin system by improving flow characteristics during lamination while maintaining compatibility with the heat-resistant BT resin and inorganic filler matrix.
3Reliability
If inorganic filler content is increased to achieve low coefficient of thermal expansion, then thermal stability is improved, but separation occurs leading to non-uniform insulation layer
Solution Approach 1:
The patent optimizes the resin composition parameters by combining BT resin, epoxy resin, and multi-functional phenolic resin in specific proportions. This parameter optimization ensures uniform distribution and adhesion of 50% or more inorganic filler during lamination, preventing separation and achieving both low CTE and uniform insulation layer without defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a uniform insulation layer with enhanced heat resistance, high reliability, and low coefficient of thermal expansion, suitable for both double-sided and multilayer printed circuit boards.
Implementation Method 1
the curing occurs at around 200° C. Thus, during heating and pressing of the prepreg laminated on the metal foil, flowability of the resin and inorganic filler becomes poor, resulting in separation therebetween
Implementation Method 2
a thermosetting resin composition comprising (a) 10 to 55% by weight of a bismaleimide-triazine or cyanate-based resin; (b) 35 to 80% by weight of an epoxy resin; and (c) 5 to 15% by weight of a multi-functional phenolic resin having a hydroxyl equivalent weight of 100 to 300 as a curing agent
Data Source
AI summary
The present invention relates to a thermosetting resin composition used in a printed circuit board for a semiconductor package, and a prepreg and a metal clad laminate using the same. More particularly, the present invention provides a thermosetting resin composition that includes a mixture of a BT or cyanate resin and an epoxy resin and a specific content of a novolac resin as a curing agent so as to inhibit separation of the resin and an inorganic filler during a process of laminating a prepreg on a metal foil, thereby providing a printed circuit board having a uniform insulation layer, and a prepreg and a metal clad laminate for a double-sided or multilayer printed circuit board that are manufactured by using the same.