PCB Pressing Structure to Prevent Conductive Post Separation
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Solution Overview
Problem
Semiconductor devices face reliability issues due to warping of printed circuit boards during the soldering process, which can cause conductive posts to separate from circuit patterns and semiconductor chips, leading to mechanical and electrical connection failures.
Innovation Solution
The use of spacers and pressing members to maintain the printed circuit board in a horizontal position during solder bonding, preventing warping and ensuring reliable mechanical and electrical connections between conductive posts and semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heating is performed to bond the conductive posts to the circuit patterns and semiconductor chips with solder, then the bonding strength is improved, but the printed circuit board warps causing separation of conductive posts
Solution Approach 1:
Pressing members are positioned on the printed circuit board before heating to apply preliminary counteracting force against the warping that will occur during soldering. This preliminary anti-action prevents the board from warping during the bonding process, maintaining contact between conductive posts and bonding surfaces while still achieving strong solder bonds.
Solution Approach 2:
The pressing members are installed and positioned in advance before the heating and bonding process. This preliminary action ensures that the printed circuit board is constrained to remain flat during soldering, preventing separation of conductive posts from bonding surfaces while allowing the bonding strength to be improved through proper heating.
2Reliability
If the printed circuit board is constrained to prevent warping, then the connection reliability is improved, but the bonding process becomes more complex
Solution Approach 1:
Pressing members serve as intermediary elements between the printed circuit board and the heating/bonding system. These intermediaries apply distributed pressure to prevent warping during bonding, improving connection reliability without significantly complicating the overall bonding process. The pressing members are simple mechanical components that can be easily integrated into existing bonding equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents the separation of conductive posts from the insulated circuit board and semiconductor chips, enhancing the mechanical and electrical reliability of the semiconductor device by maintaining stable connections.
Implementation Method 1
a pressing member disposed above the spacer with the printed circuit board between the pressing member and the spacer
Implementation Method 2
when heating is performed to bond the conductive posts attached to a printed circuit board to the circuit patterns of the insulated circuit board and the semiconductor chips with solder
Data Source
AI summary
A semiconductor device includes a semiconductor chip with an electrode, an insulated circuit board including an insulating board and a circuit pattern formed thereon. The circuit pattern has the semiconductor chip on a front surface thereof. The semiconductor device further includes a plurality of conductive posts, each having a lower end bonded to at least one of the front surface of the circuit pattern or the electrode of the semiconductor chip, and each extending vertically upward with respect to a front surface of the insulated circuit board, a printed circuit board bonded to an upper end side of each conductive post, a spacer disposed between the printed circuit board and the insulated circuit board such that a front surface of the printed circuit board faces the insulated circuit board, and a pressing member disposed above the spacer having the printed circuit board therebetween.