PCB Printing and Component Placement on a Single Production Platform
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Solution Overview
Problem
The conventional multilayer PCB production method is expensive and requires multiple machines, necessitating a need for a single apparatus and method that can produce completed circuit boards and optionally populate them with components.
Innovation Solution
A PCB production apparatus and method that uses ink and/or epoxy printing, along with component placement, featuring a table for substrate support, a function head for printing conductive and non-conductive materials, a positioner for moving the function head, and a controller to operate these components, enabling the production of multilayer circuit boards and component placement on a single platform.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional multilayer PCB production methods are used, then manufacturing precision and reliability are maintained, but device complexity and production cost increase significantly
Solution Approach 1:
The patent combines multiple specialized machines (etching machine, drilling machine, plating machine, soldering machine) into a single integrated PCB production apparatus. The function head can perform etching, drilling, plating, and soldering operations sequentially on the same substrate, eliminating the need for separate machines and reducing overall device complexity while maintaining manufacturing precision through consistent positioning.
Solution Approach 2:
The function head is designed with multi-functionality to perform various PCB manufacturing operations including etching conductive traces, drilling holes, plating copper, and soldering components. This universal function head replaces multiple specialized machines, reducing the number of devices required while maintaining the precision needed for each specific operation through integrated control and positioning systems.
2Productivity
If multiple specialized machines are used for PCB production, then manufacturing precision is maintained, but production time and process complexity increase
Solution Approach 1:
The apparatus performs preliminary actions by completing etching, drilling, plating, and soldering operations in a predetermined sequence within a single integrated process. The function head executes these operations sequentially on the same substrate without requiring intermediate handling or transfer between machines, reducing the number of processing steps and improving production speed while maintaining precision.
3Loss of time
If traditional multistep processes are used, then manufacturing precision is ensured, but production cost and time increase
Solution Approach 1:
The apparatus maintains continuity of useful action by performing etching, drilling, plating, and soldering operations in an uninterrupted sequential manner on the same substrate. The function head moves continuously between operations without requiring the substrate to be removed and repositioned on different machines, reducing total production time while ensuring circuit trace accuracy through consistent positioning and alignment throughout the process.
Data Source
AI summary
A method for producing a printed circuit board on a substrate uses control data derived from a circuit schematic, CAD file, Gerber file or files or equivalents, to operates a function head configured to effect printing conductive and non-conductive materials on the substrate and produces control data to effect the circuit printing. The method optionally uses a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.