Integrated PCB Printing With In-Situ Testing and Component Placement

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Solution Overview

Problem

The conventional multilayer printed circuit board (PCB) production method is expensive and requires multiple specialized machines, making it inefficient for producing completed circuit boards and populating them with components.

Innovation Solution

A single apparatus and method that uses ink and/or epoxy printing, combined with component placement, to produce PCBs, featuring a table for substrate support, a function head for printing conductive and non-conductive materials, and a controller for operating the printing and placement processes, allowing for the conversion of multilayer circuit board files into printing data for controlling the printing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional multilayer PCB production method is used, then manufacturing precision is maintained, but device complexity increases and productivity decreases

Engineering Contradiction:

ImprovePCB manufacturing precisionVSAvoidnumber of specialized machines

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines multiple specialized machines (etching machine, drilling machine, plating machine, component placement machine) into a single integrated apparatus that can perform all these operations sequentially on the same PCB substrate, thereby reducing device complexity while maintaining manufacturing precision through consistent positioning

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The apparatus is designed with universal functionality to perform multiple operations including etching conductive traces, drilling holes, plating through-holes, and placing electronic components on the same device, eliminating the need for multiple specialized machines and streamlining the production process

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Manufacturing precision

If conventional multilayer PCB production method is used, then manufacturing precision is maintained, but productivity decreases

Engineering Contradiction:

ImprovePCB manufacturing precisionVSAvoidproduction speed

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The apparatus enables continuous production by performing etching, drilling, plating, and component placement operations in a sequential manner on the same PCB without requiring intermediate handling or transfer between different machines, thereby maintaining manufacturing precision while significantly improving productivity

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The apparatus performs preliminary actions by completing all PCB fabrication operations (etching, drilling, plating) and component placement in one integrated process flow, eliminating subsequent repositioning and additional processing steps that would otherwise be required

Inventive Principle:

Principle #10Preliminary action

3Manufacturing precision

If conventional multilayer PCB production method is used, then manufacturing precision is maintained, but loss of time increases

Engineering Contradiction:

ImprovePCB manufacturing precisionVSAvoidproduction time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The integrated apparatus eliminates idle time and transfer time between multiple specialized machines by performing all operations continuously on the same PCB substrate in a single setup, thereby reducing total production time while maintaining manufacturing precision through consistent positioning

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the rapid and cost-effective production of PCBs by integrating printing and component placement into a single process, reducing the need for multiple machines and streamlining the manufacturing of multilayer PCBs.

Implementation Method 1

a function head configured to effect printing conductive and nonconductive materials on the substrate

Methodology Applied

Scientific EffectInkjet printing deposition: Deposition (physical)

Implementation Method 2

a function head configured to effect printing conductive and nonconductive materials on the substrate

Methodology Applied

Scientific EffectInkjet printing deposition: Deposition (physical)

Data Source

PatentUS11596071B2Apparatus for depositing conductive and nonconductive material to form a printed circuit

Publication Date: 2023.02.28 PCBIP HOLDINGS LLC

AI summary

An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to convert PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. The apparatus has a testing head to verify conductors which operates automatically. The translation module also prints nonconductive material component alignment areas and nonconductive material substrate stiffeners.