PCB Probe Hole Waveguide for Millimeter-Wave Radiation
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Solution Overview
Problem
Current millimeter-wave systems on printed circuit boards (PCBs) have complex structures with radiation propagation degradation due to the need for radiation to pass through the top lamina and separation from the waveguide structure, and are difficult to manufacture.
Innovation Solution
A millimeter-wave system with a simplified structure featuring a printed circuit board with at least two laminas, a microstrip, and a probe, where the probe is surrounded by a hole extending through both laminas, allowing millimeter-waves to be injected and guided through the PCB with electrically conductive plating and a clearance for the probe to radiate effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the probe sits on the top lamina above a hole in lower layers, then the waveguide structure is formed in lower layers, but radiation propagation is degraded by the top lamina and separation between probe and waveguide
Solution Approach 1:
The patent merges the probe support function and waveguide structure by forming the waveguide directly within the top lamina rather than separating it into lower layers. The hole and conductive plating are created in the same lamina that supports the probe, eliminating the need for the probe to radiate through the top lamina and reducing separation distance, thus improving radiation propagation quality while simplifying the overall structure.
2Reliability
If a hole extends through all laminas surrounding the probe, then radiation propagation is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent applies local quality by creating the hole and conductive plating structure only in the specific region where the probe is located, rather than modifying the entire PCB structure. The waveguide is formed locally within the top lamina around the probe, providing enhanced radiation propagation only where needed while keeping the rest of the manufacturing process simple and compatible with standard PCB fabrication techniques.
3Reliability
If electrically conductive plating is applied on the hole wall, then waveguide functionality is improved, but manufacturing steps increase
Solution Approach 1:
The patent employs self-service by integrating the conductive plating process into the existing PCB manufacturing workflow. The hole is drilled and plated using standard PCB fabrication processes that are already part of the manufacturing line, allowing the waveguide structure to be formed automatically during normal production without requiring additional specialized manufacturing steps or reducing overall manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances radiation propagation quality and simplifies manufacturing, resulting in a more efficient and easier-to-produce millimeter-wave system with fewer components and stages.
Implementation Method 1
the hole forms a wall inside the PCB. Electrically conductive plating is applied on parts of the wall that do not directly surround the probe... guides these millimeter-waves through the hole
Implementation Method 2
This form of the system radiates millimeter-waves from the probe, and guides these millimeter-waves through the hole
Data Source
AI summary
Various embodiments of millimeter-wave systems on a printed circuit board, including a microstrip, a probe, and an RF integrated circuit, as well as methods for manufacturing said systems. Various embodiments have holes extending through lamina in the PCB, thereby improving radiation propagation. Various embodiments have conductive cages created by multiple through-holes extending through lamina in the PCB, thereby increasing radiation propagation. The manufacture of such systems is easier and less expensive than the manufacture of current systems.