Multilayer PCB with Projecting Connection Regions for Low-Inductive Assembly
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Solution Overview
Problem
Existing electronic assembly groups, such as DCB modules, face issues with parasitic inductions due to long lines and connections, leading to increased complexity and reduced assembly density.
Innovation Solution
A multilayer printed circuit board structure with projecting connection regions is designed, allowing for direct contact with passive components, reducing inductive connections and parasitic inductions, and enabling a compact design by extending conductive layers beyond the core region for direct bonding with passive components like capacitors and inductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional DCB modules with long lines and connections are used, then connection between power semiconductors and passive components is achieved, but parasitic inductions increase and assembly density decreases
Solution Approach 1:
The patent extends conductive layers from the multilayer structure in a directional manner (one dimension) to create projecting connection regions. This dimensional extension allows direct contact with passive components without requiring long lateral connections, thereby reducing parasitic inductions while maintaining assembly density.
Solution Approach 2:
The patent extracts the connection function from the internal multilayer structure by creating projecting connection regions that extend beyond the core region. This extraction allows passive components to be directly connected to the power semiconductors without requiring complex internal routing, reducing both parasitic inductions and assembly complexity.
2Reliability
If long lines and connections are used in DCB modules, then electrical connections are established, but parasitic inductions increase
Solution Approach 1:
The conductive layers are extended in a directional manner from the multilayer structure to create projecting connection regions. This dimensional approach shortens the electrical path length while maintaining reliable electrical connections, thereby reducing parasitic inductions without compromising connection reliability.
3Ease of manufacture
If conventional connection methods are used, then passive components can be connected, but the number of connection points increases complexity
Solution Approach 1:
The patent merges the connection regions of multiple conductive layers to create common connection points that can directly contact passive components. This merging reduces the total number of connection points required while maintaining all necessary electrical connections, thereby simplifying the manufacturing process and reducing assembly complexity.
4Device complexity
If compact design is implemented, then assembly density increases, but connection regions must be minimized
Solution Approach 1:
The patent resolves this contradiction by extending connection regions in a specific direction from the multilayer structure. This directional extension provides sufficient connection length for reliable electrical contact while maintaining a compact overall design, as the extension is localized and does not increase the footprint of the entire assembly.
Data Source
AI summary
An electronic assembly group comprising a printed circuit board structure in a multilayer configuration that has at least two electrically conductive layers. The electronic assembly group also comprises an additional passive component that is connected to the two electrically conductive layers, each of which has at least one segment that extends beyond the multilayer structure to form connection regions, the passive component making contact directly at the connection regions.