PCB-Mounted Radar Waveguide Assembly Using Ball Contact Points
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current waveguide devices for radar applications in the automotive sector require separate mounting on radar printed circuit boards, which is costly and complex, and there is a need for a more integrated and cost-effective solution.
Innovation Solution
A waveguide device comprising a layered structure with bottom-side and top-side carriers, utilizing ball contact points for attachment to a printed circuit board, allowing for simplified integration and reduced manufacturing costs, with air-filled interiors for low loss waveguiding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If waveguide devices are implemented as separate units mounted on radar printed circuit boards, then antenna properties and radar functionality are achieved, but manufacturing complexity and costs increase
Solution Approach 1:
The patent merges the waveguide device with the printed circuit board by integrating the bottom-side carrier directly onto the PCB and using ball contact points as both mounting elements and electrical contacts. This eliminates the need for separate mounting procedures while maintaining waveguide functionality, thereby reducing manufacturing complexity without compromising antenna properties.
Solution Approach 2:
The ball contact points serve multiple functions: they mechanically attach the top-side carrier to the bottom-side carrier, provide electrical connections, and define the spacing between carriers. This multi-functionality reduces the number of separate components and steps required, addressing the contradiction between reliability and device complexity.
2Reliability
If traditional separate mounting approaches are used, then waveguide functionality is achieved, but manufacturing costs increase
Solution Approach 1:
By combining the mounting function and electrical connection function into the ball contact points array, the patent eliminates separate mounting hardware and procedures. The bottom-side carrier is directly mounted on the PCB while simultaneously establishing electrical connections, reducing component count and assembly steps, thereby lowering manufacturing costs while maintaining waveguiding capabilities.
Solution Approach 2:
The ball contact points automatically provide both mechanical support and electrical connection when the top-side carrier is placed on the bottom-side carrier. This self-service approach eliminates the need for separate mounting and wiring operations, reducing manufacturing complexity and cost while ensuring reliable waveguide functionality.
3Ease of manufacture
If ball contact points are used for attachment, then integration is simplified and costs reduced, but precision requirements increase
Solution Approach 1:
The patent extracts the precision requirement from the overall assembly process and concentrates it specifically on the ball contact points array. By using a standardized BGA-style ball contact points pattern, the precision requirement is localized to a well-established manufacturing process, simplifying overall integration while managing precision requirements through proven technology.
Solution Approach 2:
The patent specifies that the distance between carriers be less than or equal to half the wavelength of the radar radiation. This parameter constraint ensures that the ball contact points provide sufficient mechanical and electrical connection precision for high-frequency operation, balancing ease of manufacture with the necessary manufacturing precision for radar applications.
4Loss of energy
If distance between carriers is reduced to less than or equal to half wavelength, then waveguiding performance is improved, but manufacturing tolerances become more critical
Solution Approach 1:
The patent sets the carrier distance parameter to be less than or equal to half the wavelength of the radar radiation. This parameter optimization reduces waveguide loss by minimizing the propagation path through air while keeping the distance sufficient to allow for practical manufacturing tolerances of the ball contact points and carrier alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective and versatile waveguide device that can be easily integrated into electronic systems, reducing manufacturing complexity and costs while maintaining high-performance waveguiding capabilities.
Implementation Method 1
a plurality of ball contact points, which are arranged in a predetermined pattern on the bottom-side carrier and at least in regions surround a first lateral inner region of the first waveguide layer
Implementation Method 2
The waves can advantageously be guided via the first (and second) waveguide layer and the air between the respectively adjacent carriers of the stack arrangement in the interior of the waveguide device
Data Source
AI summary
A waveguide device. The waveguide device is mountable on a printed circuit board (PCB) and/or an integrated circuit device (MMIC), and includes: at least one bottom-side carrier, on which a first waveguide layer is arranged or which itself is designed as a first waveguide layer; a plurality of ball contact points, which are arranged in a predetermined pattern on the bottom-side carrier and at least partially surround a first lateral inner region of the first waveguide layer; at least a first top-side carrier, which is arranged in parallel with the bottom-side carrier and at least in regions opposite the first waveguide layer and at least in regions on the ball contact points, wherein at least one emission/incident aperture for radar radiation is present in the first top-side carrier and opposite the first lateral inner region.