PCB Radiating Elements Wireless Microchip Communication
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Solution Overview
Problem
High frequency signal transmission between microchips on a printed circuit board (PCB) often experiences interference due to parasitic radiation when using wired connections, which can reduce system performance, especially in applications requiring frequencies above 500 MHz.
Innovation Solution
The implementation of a multilayer PCB with radiating elements on both the top and underside, allowing for wireless communication between microchips, with no physical obstructions between the radiating elements, and using a main radiating element on the underside to segregate frequencies and reduce interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wired connections are used for high frequency signal transmission between microchips, then signal transmission can be achieved, but parasitic radiation interference occurs which reduces system performance
Solution Approach 1:
The patent replaces wired mechanical connections with wireless electromagnetic field communication. Radiating elements on both microchips create coupled electromagnetic fields that transmit signals without physical conductors, eliminating parasitic radiation from wired connections while maintaining high frequency signal transmission above 500 MHz
Solution Approach 2:
The patent introduces an electromagnetic field as an intermediary between the two microchips. The radiating elements generate electromagnetic fields that couple the chips wirelessly, serving as a mediator that transfers signals without direct physical contact, thereby avoiding the parasitic radiation issues inherent in wired connections
2Ease of operation
If radiating elements are placed on both top and underside of PCB, then wireless communication between microchips is enabled, but device structure becomes more complex
Solution Approach 1:
The patent utilizes the third dimension by placing radiating elements on both the top and underside of the PCB. This vertical arrangement enables wireless communication between microchips positioned at different heights or orientations, adding spatial dimensionality to the communication architecture while managing the increased structural complexity through strategic element placement
3Reliability
If main radiating element is placed on underside of PCB, then frequency segregation and interference reduction are achieved, but available space for element placement is limited
Solution Approach 1:
The patent segments the radiating elements into different functional groups placed on opposite sides of the PCB. The main radiating element on the underside operates at one frequency while elements on the top operate at another frequency, creating spatial and functional segmentation that reduces interference while utilizing the limited placement area efficiently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient high frequency communication between microchips without parasitic radiation, allowing for compact device design and reduced interference, suitable for applications like radar sensors and other high frequency applications.
Implementation Method 1
a first radiating element configured to operate a first frequency and a second radiating element configured to operate at a second frequency
Implementation Method 2
The main radiating element is configured to operate at the second radio frequency and wirelessly communicate with the second radiating element of the first microchip
Data Source
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AI summary
A device is disclosed. The device includes a wire board including metallic wiring and a first microchip connected to the metallic wiring. The first microchip includes a first radiating element configured to operate a first frequency. The device further includes a second microchip connect to the metallic wiring. The second microchip includes a second radiating element configured to operate at the first frequency. A main radiating element is also included. The main radiating element is configured to operate at a second radio frequency. The first microchip and the second microchip are physically placed such that the first radiating element faces the second radiating element.