PCB Connection Portion with Recessed Protrusions for Adhesion

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Solution Overview

Problem

As electronic devices become smaller, the decreased size of metal posts on printed circuit boards can lead to reduced adherence between the metal posts and semiconductor chips, affecting contact characteristics.

Innovation Solution

A printed circuit board design featuring a connection portion with a protruding portion and recessed portions, where the height of the recessed portions is higher than the surrounding insulating layer, enhancing contact area and adhesion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the size of metal posts is decreased to accommodate smaller electronic devices, then the device size is reduced, but the adherence between metal posts and semiconductor chips decreases

Engineering Contradiction:

Improvedevice sizeVSAvoidadherence between metal post and semiconductor chip

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The connection portion is designed with a protruding portion that extends upward from the insulating layer, adding vertical dimension to the contact interface. This three-dimensional structure increases the contact area between the metal post and semiconductor chip without increasing the horizontal footprint, thereby maintaining strong adhesion in smaller devices

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The connection portion is segmented into a protruding portion with multiple surfaces (first surface, second surface, third surface) and recess portions. This segmentation creates multiple contact interfaces that collectively increase the total contact area and improve adherence strength while keeping the overall structure compact

Inventive Principle:

Principle #1Segmentation

2Strength

If the contact area is increased to improve adherence, then the adhesion strength is enhanced, but the device size increases

Engineering Contradiction:

Improveadhesion strengthVSAvoiddevice size

Core Design Contradiction:

StrengthVSVolume of moving object

Solution Approach 1:

Instead of expanding the contact area horizontally, the invention extends the connection portion vertically with a protruding structure that rises from the insulating layer. This vertical extension provides additional contact surfaces (first, second, and third surfaces) that increase adhesion strength without increasing the device's planar dimensions

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The recess portions are nested within or adjacent to the protruding portion, creating a compact structure where multiple contact surfaces are arranged in a space-efficient manner. This nesting arrangement maximizes contact area within a minimal volume, preventing device size increase

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS20250176108A1Printed circuit board and manufacturing method thereof

Publication Date: 2025.05.29 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A printed circuit board according to an embodiment includes a first insulating layer, a pad portion disposed on the first insulating layer, a connection portion disposed on the pad portion and including a protruding portion and a first recess portion disposed inside the protruding portion, and a second insulating layer disposed on a part of the connection portion and exposing a part of the connection portion, wherein a height of the first recess portion of the connection portion from the first insulating layer is higher than a second height of the second insulating layer disposed on a side of the connection portion.