Circuit Board Reinforcing Structure with Corner Notches
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Solution Overview
Problem
Miniaturization of electronic devices leads to increased vulnerability of solder bump bonding parts to thermal stress and external pressure, resulting in poor connections and high spoilage costs due to deformation of circuit boards and difficulty in removing semiconductor devices for malfunction diagnosis.
Innovation Solution
A board reinforcing structure with a reinforcing member bonded to the rear surface of the circuit board, featuring notches at the corner parts to disperse stress and reduce warpage, allowing for improved pressure resistance and long-term reliability of solder bonding parts without the need for underfill materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit board is miniaturized to reduce device size, then the device size is reduced, but the solder bump bonding parts become more vulnerable to thermal stress and external pressure
Solution Approach 1:
The reinforcing member is strategically placed at the four corner regions of the circuit board, which are the areas most susceptible to warpage and stress concentration. This localized reinforcement approach provides targeted support to protect solder bump bonding parts without adding unnecessary weight or complexity to the entire board structure.
Solution Approach 2:
The reinforcing member is formed from a material with different physical properties (higher rigidity and strength) than the circuit board substrate. This composite structure combines the flexibility of the PCB with the strength of the reinforcing member, creating a hybrid structure that resists warpage and external pressure while maintaining the board's fundamental characteristics.
2Reliability
If a reinforcing member is added to reduce warpage and improve reliability, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The reinforcing member is divided into multiple discrete reinforcing portions, each positioned at the four corner regions of the circuit board. This segmentation allows for targeted reinforcement where it is most needed while keeping the overall structure simple and manageable. Each corner portion independently contributes to reducing warpage without requiring a complex continuous structure.
Solution Approach 2:
The reinforcing member's physical parameters (material composition, thickness, shape) are optimized to achieve the desired reinforcement effect with minimal added complexity. By carefully controlling these parameters, the design achieves effective warpage reduction while maintaining simplicity in manufacturing and assembly.
3Reliability
If underfill materials are used to protect solder bumps, then the connection reliability is improved, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The reinforcing member is pre-installed on the circuit board before the soldering process. This preliminary reinforcement structure proactively prevents warpage and stress-related issues before they can affect the solder bumps, eliminating the need for additional underfill materials and complex post-soldering processes.
Solution Approach 2:
The invention extracts and eliminates the need for underfill materials by implementing an alternative reinforcement approach using the reinforcing member. This removes a complex and costly manufacturing step while achieving the same protective function through structural design rather than material application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reinforcing structure effectively reduces stress on solder bumps, preventing connection failures and enabling easy removal of semiconductor devices, thus enhancing the reliability and maintainability of electronic devices.
Implementation Method 1
a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board
Implementation Method 2
corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches
Data Source
AI summary
Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.