PCB Relay Power Distribution for High-Density EV Charging
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Solution Overview
Problem
Existing power distribution apparatuses face challenges in improving through-current density and reducing size while meeting diversified charging requirements of electric vehicles, particularly with increasing charging power demands.
Innovation Solution
A power distribution apparatus with a PCB and relays, featuring groups of current input and output paths, and integrated relays with lead-out pins, utilizing copper or aluminum bars for enhanced current transmission and heat dissipation, along with optimized relay and PCB assembly to minimize size and improve flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the charging power of electric vehicles is increased, then the through-current density of the power distribution apparatus needs to be improved, but the size of the power distribution apparatus tends to increase
Solution Approach 1:
The patent merges multiple current paths onto a single PCB substrate, integrating positive and negative current paths for multiple charging interfaces in one compact structure. This consolidation allows high current density to be achieved without proportionally increasing the overall apparatus volume, as multiple current-carrying functions are combined in a shared space.
Solution Approach 2:
The patent utilizes the third dimension by routing current paths through both the top and bottom surfaces of the PCB, and through internal copper layers. This multi-layer approach allows current to flow through multiple planes simultaneously, effectively increasing the current-carrying cross-section without increasing the footprint area, thus achieving high through-current density in a compact volume.
2Adaptability or versatility
If multiple charging interfaces are supported to meet diversified charging requirements, then power distribution flexibility is improved, but the complexity of external cable connections increases
Solution Approach 1:
The PCB is designed as a universal platform that can support multiple types of charging interfaces (AC and DC charging) through standardized current path configurations. The same PCB structure can serve different charging functions by activating different relay combinations, eliminating the need for separate dedicated circuits for each interface type and reducing overall system complexity.
Solution Approach 2:
The patent extracts the power distribution switching function from external cable connections and relocates it to the relay system integrated on the PCB. By moving the switching logic inside the apparatus to the relay control system, the external cable connections are simplified to primarily power transmission roles, while the complex routing and switching functions are handled internally by the relay-controlled current paths.
3Productivity
If the area of PCB is fully utilized to reduce apparatus size, then manufacturing efficiency is improved, but assembly precision requirements increase
Solution Approach 1:
The PCB is segmented into distinct functional zones with clearly defined current paths, relay mounting areas, and terminal regions. This segmentation allows for modular assembly processes where different components can be installed in systematic sequences, reducing the complexity of precision alignment while maximizing the utilization of PCB area for current-carrying functions.
Data Source
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AI summary
Embodiments of this application provide a power distribution apparatus and a charging pile. The power distribution apparatus includes a plurality of relays and a PCB. The relay includes an input lead-out pin and an output lead-out pin. A top surface or the inside of the PCB includes a plurality of groups of current input paths. A bottom surface of the PCB includes a plurality of groups of current output paths. The current input path is configured to receive a current, and the current output path is configured to output a current. The input lead-out pin of the relay is connected to the current input path, and the output lead-out pin of the relay is connected to the current output path.