PCB Release Film Structure for Protected Connector Assembly
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Solution Overview
Problem
Existing technologies lack effective protection and safe transportation methods for printed circuit boards during the process of connecting them to display modules, exposing them to potential damage.
Innovation Solution
A release film system comprising a first and second release film with adhesives is applied to the printed circuit board and connector, creating openings to expose connection points while providing protection and facilitating safe handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If printed circuit boards are separately manufactured and then connected to display modules, then manufacturing flexibility is improved, but the risk of damage during transfer and connection increases
Solution Approach 1:
The release film is pre-applied to the printed circuit board before manufacturing processes are completed. This preliminary protective action ensures that the board is already protected when it needs to be transferred and connected to the display module, eliminating the damage risk associated with separate manufacturing and transfer operations.
Solution Approach 2:
The release film acts as an intermediary protective layer between the printed circuit board and the external environment during transfer and connection operations. This intermediate protective element allows manufacturing flexibility while preventing direct contact and potential damage during handling.
2Reliability
If release film is applied to protect printed circuit board, then protection during transfer is improved, but connection access to pads becomes difficult
Solution Approach 1:
The release film is segmented with openings at specific locations where connection pads are positioned. This segmentation allows the film to provide comprehensive protection across the entire board surface while creating localized access points that enable easy connection operations without removing the protective film.
Solution Approach 2:
The release film has different properties in different regions: it provides continuous coverage and protection in most areas, while having openings in specific local regions where connection access is needed. This local variation in quality allows simultaneous achievement of protection and ease of connection.
3Reliability
If multiple release films are used to cover both surfaces of printed circuit board, then comprehensive protection is improved, but device complexity increases
Solution Approach 1:
Multiple release films are merged into a single integrated structure with openings positioned to expose connection pads. Instead of using separate films that would need to be applied and removed independently, the invention combines them into one unified protective layer that provides comprehensive coverage while enabling access where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures safe handling and protection of printed circuit boards during transfer and connection to display modules, reducing the risk of damage and enhancing the overall assembly process.
Implementation Method 1
a first adhesive attached to a portion of a surface of the first release film that does not overlap the second release film, and extending towards the second release film and covering a portion of a surface of the second release film
Data Source
AI summary
A release film on a printed circuit board and a connector connected to the printed circuit board includes a first release film disposed on a first surface of the printed circuit board and a surface of the connector, a second release film disposed on a second surface of the printed circuit board opposite to the first surface of the printed circuit board, and a first adhesive attached to a portion of a surface of the first release film that does not overlap the second release film, extending towards the second release film and covering a portion of a surface of the second release film that does not face the first release film.