PCB Solder Resist Reprint With Volume-Based Defect Filling
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Solution Overview
Problem
In the photolithography process for circuit board manufacturing, defects such as pinholes in the solder resist layer can lead to unintended exposure of metal layers, resulting in costly material and process losses due to the discarding of defective substrates.
Innovation Solution
A reprint apparatus and method that includes a defect checking unit to calculate the volume of defective areas, a material filling unit to accurately discharge a filling material based on the calculated volume, and a curing unit to cure the material, allowing for the repair of defective solder resist layers on circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If photolithography process is used to manufacture circuit boards, then complex patterns can be formed on circuit boards in large quantities, but partial defects such as pinholes may occur in the photoresist pattern causing metal layers to be unintentionally exposed
Solution Approach 1:
The patent applies the discarding and recovering principle by enabling the recovery and reuse of defective circuit boards through automated reprinting. Instead of discarding boards with pinhole defects, the system detects defective areas, applies corrective material only to those specific regions, and cures them to restore functionality. This transforms a waste-generating process into a value-recovering process, allowing defective substrates to be reused and significantly reducing material and process costs.
2Reliability
If all defective substrates are discarded, then defect-free products are ensured, but both material costs and process costs are lost increasing overall production cost
Solution Approach 1:
The patent applies the local quality principle by targeting repair efforts only to defective regions rather than treating the entire substrate uniformly. The system uses defect detection to identify pinhole locations, then applies filling material and curing processes exclusively to those localized areas. This selective approach preserves the value of non-defective regions and minimizes material consumption, allowing cost-effective recovery of partially defective boards while maintaining overall product quality.
3Manufacturing precision
If filling material is applied to defective portions, then repair of solder resist layer is achieved, but inaccurate filling may cause material overflow or misplacement
Solution Approach 1:
The patent applies the feedback principle by implementing an automated closed-loop system that uses defect detection information to control the filling process. The system detects defective areas, calculates the precise volume of material needed based on defect characteristics, and controls the dispensing of filling material accordingly. This feedback-driven approach ensures accurate material application, preventing overflow or misplacement while maintaining ease of manufacture through automation.
4Loss of substance
If automated reprinting process is implemented, then defective portions can be precisely repaired reducing material costs, but device complexity increases
Solution Approach 1:
The patent applies the universality principle by designing a multi-functional reprinting apparatus that integrates defect detection, volume calculation, material dispensing, and curing capabilities into a single automated system. This universal device can handle various types of defects and perform multiple operations sequentially, reducing the need for separate equipment and processes. The integrated design manages device complexity while achieving precise repair and material cost reduction through automated multi-functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the precise repair of defective solder resist layers, reducing material and process costs by allowing for the reuse of circuit boards, while ensuring accurate and quantitative filling and curing of the solder resist patches, thus preventing material overflow or misplacement.
Implementation Method 1
a curing unit configured to cure the material filled in the defective portion
Data Source
AI summary
A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.