Selective Resin Coating on PCB Components
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Solution Overview
Problem
Some electronic components entirely coated with resin can cause inconvenience, such as obstructing the function of pressure valves and heat dissipation surfaces, and result in unnecessary resin usage, increasing manufacturing costs.
Innovation Solution
The method involves partially exposing predetermined electronic components from the resin coating, specifically at joint portions between components and wiring patterns on a printed circuit board, using a dam or jig to control the resin flow and ensure protection of critical areas like pressure valves and heat dissipation surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are entirely coated with resin, then protection from moisture and dust is improved, but functionality of pressure valves and heat dissipation surfaces deteriorates
Solution Approach 1:
The patent applies resin coating selectively to specific regions rather than uniformly across all components. The coating is applied to protect joint portions and wiring patterns while deliberately excluding areas like pressure valves and heat dissipation surfaces that require functionality. This local differentiation resolves the contradiction by providing protection where needed while maintaining functionality where required.
2Reliability
If electronic components are entirely coated with resin, then protection from moisture and dust is improved, but resin usage increases and manufacturing cost increases
Solution Approach 1:
The patent extracts or removes the resin coating from specific areas that do not require protection, such as pressure valves and heat dissipation surfaces. By taking out the coating material from these non-critical areas, the total quantity of resin used is reduced while maintaining adequate protection in critical joint portions and wiring areas, thereby lowering manufacturing costs.
3Reliability
If resin coating is applied to all areas, then protection coverage is improved, but complexity of controlling resin flow increases
Solution Approach 1:
The patent segments the coating area into distinct regions: areas requiring protection (joint portions, wiring patterns) and areas requiring no coating (pressure valves, heat dissipation surfaces). This segmentation simplifies the resin flow control process by defining clear boundaries and target areas, reducing the complexity of controlling where the resin should and should not flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for proper functioning of sensitive components, minimizes resin usage, and reduces manufacturing costs by selectively exposing critical areas from the resin coating, while effectively protecting other joint portions.
Implementation Method 1
a printed circuit board and components are integrally molded by hot-melt molding
Data Source
Figure 1
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Figure 5~7
AI summary
A printed circuit board (12) with each of both surfaces serving as a component mounting surface (12a, 12b) is provided. The component mounting surface (12a, 12b) has a predetermined region (A, B) on which electronic components are coated with a resin (P). A predetermined one of the electronic components in the region (A, B) is not covered with the resin (P) at a portion above a predetermined height (H) from the component mounting surface (12a, 12b).