PCB Resin Composition for Low Loss and Copper Peel Strength
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Solution Overview
Problem
Current resin compositions for printed circuit boards fall short in dissipation factor, copper foil peeling strength, flame retardancy, and X-axis coefficient of thermal expansion, failing to meet the demands of modern electronic products.
Innovation Solution
A resin composition comprising a vinyl group-containing resin and a prepolymer, formed through a prepolymerization reaction with specific compounds in a molar ratio, which is used to create articles like prepregs, resin films, and printed circuit boards, enhancing performance in dissipation factor, copper foil peeling strength, and flame retardancy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional resin compositions are used for printed circuit boards, then manufacturing is simple and cost-effective, but the dissipation factor is insufficient and copper foil peeling strength is poor
Solution Approach 1:
The patent uses a composite resin system combining vinyl group-containing resin with epoxy resin and cyclic carbonate monomer. This composite approach achieves superior copper foil peeling strength and dissipation factor by leveraging the complementary properties of each component, where vinyl group-containing resin provides low dissipation factor and enhanced adhesion, while epoxy resin provides structural strength and crosslinking capability.
Solution Approach 2:
The patent optimizes the molar ratio of cyclic carbonate monomer to epoxy resin between 0.5:1 and 2:1, and controls vinyl group-containing resin content at 5-50 parts by weight per 100 parts of epoxy resin. These parameter adjustments achieve the optimal balance between copper foil peeling strength, dissipation factor, and flame retardancy without excessive formulation complexity.
2Object-affected harmful factors
If conventional resin compositions are used, then formulation is simple, but flame retardancy is insufficient
Solution Approach 1:
The patent incorporates cyclic carbonate monomer (such as 1,3-propanesultone or 1,4-butanesultone) into the resin system to achieve V-0 flame retardancy rating. The cyclic carbonate monomer reacts with epoxy resin to form a flame-retardant crosslinked network, providing excellent flame resistance while maintaining formulation simplicity through a straightforward curing process.
3Stability of the object's composition
If conventional resin compositions are used, then processing is straightforward, but X-axis coefficient of thermal expansion is poor
Solution Approach 1:
The patent achieves low X-axis coefficient of thermal expansion (close to copper foil expansion) by optimizing the crosslinking density through controlled cyclic carbonate monomer to epoxy resin molar ratio (0.5:1 to 2:1). This parameter optimization creates a crosslinked network with appropriate rigidity and thermal stability, matching the thermal expansion characteristics of copper foil without requiring complex filler systems.
4Strength
If vinyl group-containing resin and prepolymer with specific molar ratio are used, then dissipation factor is improved and copper foil peeling strength is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent uses a prepolymer containing vinyl groups formed by partial reaction between vinyl group-containing resin and cyclic carbonate monomer. This preliminary reaction creates a pre-functionalized polymer that requires only final curing to complete the crosslinking, simplifying the manufacturing process while achieving superior copper foil peeling strength and dissipation factor through the controlled prepolymerization approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves improved performance in dissipation factor, copper foil peeling strength, and X-axis coefficient of thermal expansion, making it suitable for high-performance substrates in electronic products.
Implementation Method 1
the prepolymer is made from a mixture by a prepolymerization reaction, and the mixture comprises a compound represented by Formula (1) and a compound represented by Formula (2) with a molar ratio between 4:1 and 50:1
Data Source
AI summary
A resin composition is provided, comprising a vinyl group-containing resin and a prepolymer. The prepolymer is made from a mixture by a prepolymerization reaction, and the mixture comprises a compound represented by Formula (1) and a compound represented by Formula (2). Also, an article made from the resin composition is provided, comprising a prepreg, a resin film, a laminate or printed circuit board.